Market Trends– category –
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Samsung Considers New HBM-Focused Advanced Semiconductor Packaging Plant in South Korea’s Honam Region to Meet AI Server Demand
SamMobile South Korea Overview Samsung Electronics is exploring the construction of a new advanced semiconductor packaging facility in South Korea's Honam region, with Gwangju emerging as a prime candidate. This project aims to bolster S... -
SK Hynix Holds U.S. Talks on HBM Supply and Investment Plans, Bolstering Domestic Semiconductor Supply Chain
digitimes Taiwan Overview SK Hynix reportedly held private discussions with U.S. Deputy Assistant Secretary Alison Hooker regarding high-bandwidth memory (HBM) supply to key U.S. tech firms and potential semiconductor investment plans in... -
AI Infrastructure Demand Intensifies Memory Shortage: TSMC CoWoS Constraints and Vietnam Labor Shortages Create Compound Challenges
Sourceability USA Overview Rising AI infrastructure demand is generating new challenges across the semiconductor supply chain, notably a worsening memory shortage. TSMC's CoWoS packaging limitations are expected to persist with the AI bo... -
TSMC and Amkor Sign 10-Year Advanced Packaging Deal in Arizona, Amkor to Invest $7B for CoWoS Supply Boost and US Ecosystem Build-out
Bignewsnetwork India Overview TSMC and Amkor have signed a 10-year strategic agreement to expand semiconductor packaging capabilities in Arizona, USA. This partnership focuses on cutting-edge packaging technologies, including TSMC's InFO... -
TSMC’s CoWoS Shortage Eases, But Bottleneck Shifts to ‘Hyper-Scale Packaging’ as Google Reportedly Engages Samsung for TPU Production
Zhitong Finance APP Hong Kong Overview Reports suggest Google is in discussions with Samsung Electronics regarding the production of specific hardware components for its AI training and inference Tensor Processing Units (TPUs), highlight... -
ASE Technology Raises 2026 LEAP Revenue Outlook Above $3.5 Billion, Driven by Soaring AI Advanced Packaging Demand
Zacks USA Overview ASE Technology Holding expressed strong confidence in its Leading Edge Advanced Packaging (LEAP) business trajectory, raising its 2026 LEAP revenue outlook by 10% to over $3.5 billion. This upward revision explicitly r... -
TSMC Narrows CoWoS Supply-Demand Gap from 20% to 10% by End of 2026; NVIDIA to Adopt Next-Gen CoPoS for 2028-2029 Mass Production
Moomoo Singapore Overview TSMC is accelerating advanced packaging capacity expansion, projecting its CoWoS supply-demand gap to significantly narrow from approximately 20% to 10% by the end of 2026. Concurrently, research and development... -
AT&S Unveils €2 Billion Kulim Expansion to Fuel AI Boom with Advanced IC Substrates and PCBs
AT&S Official Press Release オーストリア Overview AT&S is undertaking a monumental €1.5 billion to €2 billion expansion of its Kulim, Malaysia, manufacturing facility. Driven by long-term commitments from industry leaders like AMD, t... -
Advanced Packaging: Glass Core Substrates Emerge as Next-Gen Frontier; Intel Commits Over $1 Billion to R&D for High-Volume Production by 2030
Infra Startups USA Overview Advanced packaging is a critical bottleneck in the AI boom, with TSMC's CoWoS capacity dictating the pace of global AI infrastructure build-out. Shipments of CoWoS wafers are projected to reach approximately 4... -
Samsung, SK Hynix Eye Honam Region in South Korea for First Advanced Packaging Fabs Amid Soaring AI Memory Demand; Amkor Plans $980M Expansion
The Elec Inc. South Korea Overview Samsung Electronics and SK Hynix are considering establishing their first advanced semiconductor packaging plants in South Korea's Honam region to meet surging AI infrastructure demand. Samsung is weigh...
