Semiconductor Back-End– category –
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Semiconductor Back-End Weekly Report August 16, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 16, 2026 (PDF) — Download Weekly Report August 16, 2026 (PDF) — DownloadDownload 🎙 Podcast August 16, ... -
TSMC Declares AI Advanced Packaging Competition Shifts to System-Level Reliability and Validation, Highlighting 3DIC Importance at OCP APAC 2026
digitimes Taiwan Overview At the OCP APAC 2026 summit, TSMC Vice President of Advanced Packaging Technology & Service, Jun He, announced that the escalating AI computing demand is rapidly increasing chip integration complexity, shift... -
Global Semiconductor Sales Soar 2.2x to Record $134.5 Billion in June 2026; TSMC Achieves Over 99% CoWoS Yield But Flags HBM and ABF Substrate Bottlenecks
Amiko Consulting Japan Overview Global semiconductor sales reached an unprecedented monthly high of $134.5 billion in June 2026, marking a 2.2-fold increase year-over-year, driven by a dramatic surge in AI data center investments across ... -
NXP to Double Malaysia Backend Capacity by Q1 2028; Resonac Reports 46% Growth in AI Backend Materials
note Japan Overview NXP Semiconductors has initiated construction of a new assembly and test (A&T) facility in Malaysia, projected to more than double the site's overall production capacity by Q1 2028 through advanced automation. Con... -
Global Semiconductor Capital Investment to Surge 30% to $240 Billion in 2026, Driven by AI Inference Demand; Advanced Packaging Fuels Multi-Year Double-Digit Growth
Soka Technology Unknown Overview The global semiconductor industry is projected to enter an unprecedented capital investment supercycle in 2026, driven by a skyrocketing demand for AI inference capabilities. Industry forecasts estimate t... -
Intel Foundry Boosts AI Data Center Compute with Foveros and EMIB Advanced Packaging, EMIB-T Launch Planned for 2026
ET Datacenters India Overview Intel Foundry is actively deploying advanced packaging technologies, including Foveros stacking and Embedded Multi-die Interconnect Bridge (EMIB) interconnects, to meet the escalating demands of AI workloads... -
ASMPT’s Advanced Packaging Business Achieves Record H1 2026 Sales Driven by Surging AI Demand; Panel-Level Packaging Positioned as Key Future Growth Driver
ASMPT Corporate (Press Release) Hong Kong Overview ASMPT reported robust interim results for H1 2026, with its Advanced Packaging (AP) business achieving record sales, primarily fueled by the accelerating demand from the AI sector. The c... -
Samsung Electro-Mechanics Doubles Down on AI: Vietnam Plant to Lead Advanced Packaging Substrate Surge
Vietnam Korea Times Vietnam Overview Samsung Electro-Mechanics (SEMCO) is poised to significantly expand its production of advanced packaging substrates for AI semiconductors, with a reported 2.4-fold capacity increase at its Thai Nguyen... -
U.S. Commerce Department to Invest Up to $874 Million in Seven Semiconductor Companies Across AI, Advanced Packaging, and Supply Chain Security
AnySilicon USA Overview The U.S. Department of Commerce announced its intent to provide up to $874 million in incentives to seven semiconductor technology companies, targeting critical areas such as AI, advanced computing, semiconductor ... -
Applied Materials Significantly Upscales 2026 Advanced Packaging Growth Forecast to Over 70% as AI Chip Investment Shifts to HBM and Multi-Layer Integration
Xenospectrum USA Overview Applied Materials has substantially elevated its 2026 advanced packaging revenue growth forecast to over 70%, a 20-point jump from its previous 50%+ projection. This revision reflects a critical expansion of AI ...
