Photonics– category –
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Photonics Weekly Report October 4, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report October 04, 2026 (PDF) — Download Weekly Report October 04, 2026 (PDF) — DownloadDownload 🎙 Podcast October 0... -
AIST and Xanadu: Photonic quantum scaling and C$195M investment
QubitWire Japan Overview Japan's National Institute of Advanced Industrial Science and Technology (AIST) has released a detailed roadmap outlining necessary improvements in light sources, detectors, and control hardware for scaling photo... -
Lightmatter: Passage and Guide specs for 300mm silicon wafers
The Diligence Stack USA Overview Lightmatter CEO Nick Harris outlined the company's strategy to resolve computing's interconnect bottleneck using its Passage™ and Guide™ products, which establish optical links from near-packaged optics (... -
Quandela: III-V quantum dot devices and 2026 scaling roadmap
Quandela France Overview Quandela highlights research demonstrating that foundry-compatible III–V quantum-dot devices can provide the core light–matter capabilities for scalable hybrid photonic quantum computing. This work signifies a sh... -
Optica Kerr Frequency Microcombs: GPU/CPU CPO roadmap
Optica Publishing Group / OPN (Optics & Photonics News) USA Overview Optica's VP Alexander Gaeta unveiled a significant breakthrough in the commercialization of milliwatt-power, compact, and robust Kerr frequency microcombs. This technol... -
Lessengers 3.2T NPO: Glass substrate AI switch power specs
Lightwave USA Overview Lessengers has introduced a 3.2T glass substrate Near-Packaged Optics (NPO) platform for AI and HPC fabrics, delivering 3.2 Tbps per optical engine. This innovative Direct Optical Wiring (DOW) technology significan... -
FIBERSTAMP 1.6T OSFP224: 18W hybrid transceiver specs
Lightwave Online (FIBERSTAMP) Singapore Overview FIBERSTAMP launched its HYBRID 1.6T OSFP224-HRO 2×DR4 heterogeneous silicon photonics transceiver, achieving a maximum module power of 18W. This low power consumption is enabled by a propr... -
TARLUZ 1.6T OSFP224 DAC: AI data center latency and specs
TARLUZ China Overview TARLUZ has introduced a 1.6T OSFP224 Direct Attach Cable (DAC) for AI clusters, achieving zero power consumption, near-zero latency, and significant cost reductions for intra-rack connections under 1 meter. This DAC... -
Marvell: 2nm silicon photonics 3.2Tbps specs for ECOC 2026
remio AI USA Overview Marvell announced a demonstration at ECOC 2026 of groundbreaking 400 gigabits/lane PAM4 and 3.2 terabit optical modules, built on its industry-leading 2nm silicon photonics technology. The company has already proven... -
Racyics UCIe PHY IP: GlobalFoundries 22FDX silicon validation
Chiplet Marketplace Germany Overview Racyics announced the successful silicon validation of its Universal Chiplet Interconnect Express (UCIe) PHY IP for GlobalFoundries' 22FDX process. UCIe provides a common interface for efficiently con...
