New Technology– category –
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New Technology
POSTECH Bio-Adhesive: Mussel-Inspired Underwater Bonding Mechanism
NEWSIS South Korea Overview Researchers from POSTECH and Kangwon National University have developed a next-generation bio-adhesive by mimicking the charge arrangement of mussel adhesive proteins. The team successfully identified the mole... -
New Technology
Polysulfide Sealants: Cotton Fibers and Silane for 60-Min Fire Resistance
BIOENGINEER.ORG USA Overview A new formulation strategy using surface-treated cotton fibers and silane coupling agents allows two-component polysulfide sealants to maintain mechanical strength while passing a 60-minute fire resistance te... -
New Technology
SK Ecoplant Materials and Furukawa Electric: AI Material MOU
CNET Japan Japan Overview SK Ecoplant Materials and Furukawa Electric have signed a Memorandum of Understanding (MOU) to expand high-performance materials for semiconductor and AI data center markets. The partnership focuses on integrati... -
New Technology
Qnity Thermal Solutions: AI Data Center Cooling for DDR5 DIMMs
MyChesCo USA Overview Qnity Electronics Inc. has expanded its semiconductor materials portfolio with two new thermal management products targeting high-density AI data centers. These solutions address the heat loads generated by modern s... -
New Technology
Plasma Surface Activation: Argon vs Nitrogen for Plastic Bonding
Bioengineer.org Overview Nitrogen and argon atmospheric-pressure plasma significantly increase the lap-shear strength of engineering plastics, with nitrogen boosting PVC and PP adhesion by up to six-fold. However, research indicates that... -
New Technology
Boron Nitride Composites: Tuning Heat Flow via MSLA 3D Printing
Bioengineer.org USA Overview Researchers have demonstrated that masked stereolithography (MSLA) 3D printing can control the orientation of hexagonal boron nitride (h-BN) platelets to tune thermal conductivity. By adjusting platelet size ... -
New Technology
Nano-silver Sintering: Reliability on Cyanate Ester Composites
Research Square Overview Low-temperature nano-silver sintering enables the direct bonding of power chips to fiber-reinforced cyanate ester composite substrates with a maximum shear strength of 11.5 MPa. The joints maintain 9.3 MPa streng... -
New Technology
Boron Nitride Hybrid Network: Thermal Specs for EVA Solar Films
BIOENGINEER.ORG China Overview Researchers have developed an EVA composite film using a boron nitride hybrid network that increases through-plane thermal conductivity by 1245% to 2.96 W/m-K. This material reduces photovoltaic module temp... -
New Technology
Fluorine-Free Battery Binders: Sustainable LFP Recycling Path
C&EN (ACS) USA Overview Researchers have developed a fluorine-free, water-soluble binder for battery cathodes to reduce manufacturing costs and environmental impact. This chemistry is designed to make the recycling of lithium-iron-phosph... -
New Technology
CSRM: Non-destructive polymer degradation tracking in PV modules
pv magazine India Germany Overview Researchers in Germany have demonstrated that compressive stress relaxation measurement (CSRM) can monitor polymer degradation in aging photovoltaic modules. The study found that PV module power degrada...