New Technology– category –
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Researchers Develop Wafer-Scale Bonded Active Photonics Interposer: Pioneering Low-Loss, High-Bandwidth Optoelectronic Integration
EurekAlert! USA Overview Researchers have developed a wafer-scale bonded active photonics interposer that integrates photonic devices with electronic circuits at the wafer level, enabling low-loss, high-bandwidth communication with mass ... -
Tyndall National Institute Unveils Three Papers at ESTC 2026 Advancing Photonic Packaging and Chiplet Integration
Tyndall National Institute Ireland Overview Researchers from Tyndall National Institute presented three pivotal papers at ESTC 2026, showcasing significant innovations in photonic packaging, co-packaged optics, and chiplet integration te... -
TESA Unveils Innovative Adhesive Solutions to Meet Demands of Miniaturized and Complex Electronic Devices
TESA Germany Overview TESA is showcasing its innovative electronic adhesive solutions engineered for bonding, mounting, sealing, cushioning, shielding, and encapsulation in increasingly small and complex electronic devices. These solutio... -
Taiyo Holdings Achieves First 700nm CD Three-Layer RDL Formation on 12-Inch Wafers with New FPIM Series for Advanced Semiconductor Packaging
Morningstar (Taiyo Holdings Co. Ltd.) Japan Overview Taiyo Holdings has launched its "FPIM Series" next-generation semiconductor-packaging material, achieving the industry's first three-layer Redistribution Layer (RDL) formation with a 7... -
KAIST Engineers E. coli to Produce Glucose-Based Biodegradable Hot-Melt Adhesives, Outperforming Petroleum Counterparts
Mirage News (referencing KAIST) South Korea Overview KAIST researchers have developed a glucose-based adhesive as an alternative to petroleum-derived hot-melt adhesives by genetically engineering *Escherichia coli* to produce novel aroma... -
NovoLINC Unveils MaxLINC, Achieving Industry-Leading 0.7 mm²•K/W Thermal Resistance for Multi-Kilowatt AI Chips
PR Newswire (NovoLINC) Unknown Overview NovoLINC has launched MaxLINC, an advanced thermal interface material (TIM) designed for high-performance AI computing, achieving an industry-leading thermal resistance as low as 0.7 mm²•K/W. This ... -
Penn State and Kurt J. Lesker Company Form Atomic-Scale Processing Hub for Semiconductors and Quantum Tech
Penn State USA Overview Penn State University and Kurt J. Lesker Company have established a strategic partnership to accelerate advanced atomic-scale processing methods crucial for semiconductors, advanced packaging, quantum, and photoni... -
Gel-Based Cooling Pad Market Poised for Growth Through 2035, Driven by Biopharma Cold Chain and EV Demand
IndexBox Global Overview The global gel-based cooling pads market is projected for substantial growth through 2035, primarily fueled by the expanding biopharma cold chain, consumer electronics, and electric vehicle (EV) battery pack appl... -
Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge Technology for 2.1D AI Semiconductor Packaging
The Elec South Korea Overview Samsung Electro-Mechanics and Qualcomm are collaboratively developing an advanced "organic bridge" technology for 2.1D packaging in AI semiconductors. This innovation utilizes organic materials, akin to PCBs... -
KAIST Develops Smartphone-Controlled Adhesive Microneedle Electronic Medicine for Remote Pain Management
Ground News (Yonhap News Agency) South Korea Overview A KAIST-led research team, in collaboration with the Korea Institute of Oriental Medicine, has developed an adhesive microneedle electronic medicine for smartphone-controlled remote p...
