New Technology– category –
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Advanced Packaging Warpage Mitigation: Research Advances in Incorporating Negative Coefficient of Thermal Expansion Materials into Epoxy Molding Compounds and Underfills
Semiconductor Engineering USA Overview Active research is progressing on utilizing negative coefficient of thermal expansion (CTE) materials in epoxy molding compounds (EMC) and underfills to effectively mitigate warpage in large semicon... -
NIST and UCSD Develop Predictive Modeling for Cure Behavior and Thermal Endurance of Advanced Packaging Epoxy Underfills
Semiconductor Engineering USA Overview Researchers from the National Institute of Standards and Technology (NIST) and the University of California San Diego (UCSD) have published a technical paper detailing a new modeling technique to ac... -
SK Hynix Breakthrough: Mass Reflow Underfill Molding Overcomes HBM Stacking Thermal Challenges, While Micron’s Hybrid Bonding Slashes Power Consumption by 30%
CSIS USA Overview SK Hynix has established a lead in HBM chip stacking by investing heavily in 'Mass Reflow Underfill Molding' (MR-MUF), a novel packaging technique that resolves the thermal and physical constraints of multi-die HBM stac...
