New Technology– category –

Tom's Hardware USA Overview Electron microscope testing reveals that liquid metal thermal interface materials (TIM) do not dry out but instead react chemically with copper to form a solid compound. While nickel plating reduces the thickn...

OAE Publishing China Overview Researchers have developed a one-step direct laser writing strategy to transform pristine PDMS into a superhydrophobic silicon oxycarbide (SiOC)/graphenic composite. This monolithic platform achieves a 94.47...

Henkel Adhesive Germany Overview Henkel has developed a next-generation zirconium-based, phosphate-free cleaner-coater, BONDERITE M-NT 41040, to replace traditional iron phosphate technologies. The solution enables room-temperature appli...

Resource Recycling USA Overview Researchers from the University of California San Diego and Toyota Research Institute of North America have developed a water-processable, fluorine-free battery binder. This innovation reduces energy costs...

Southwest Jiaotong University China Overview Researchers at Southwest Jiaotong University, led by Associate Professor Hongkun Li, have devised a hybrid thermal management strategy for β-Ga₂O₃ MOSFETs that combines a diamond thermal sprea...

EBest Circuit China Overview Intel's EMIB-T substrate technology has reported significant development results at ECTC 2026, featuring a 25 μm first-level interconnect bump pitch and 120 × 120 mm package dimensions. This advanced packagin...

Henkel Adhesive Germany Overview Henkel's Bergquist® HI-FLOW THF 1600P phase-change thermal interface material (TIM) has been successfully deployed in next-generation motor controllers, effectively managing high power densities and meeti...

SemiMedia Japan Overview Resonac Holdings has successfully developed Japan's first 300mm single-crystal silicon carbide (SiC) substrate, representing a major leap in semiconductor manufacturing. This 12-inch wafer provides approximately ...

Master Bond Inc. USA Overview Master Bond has launched EP48TC, a high-performance, two-component epoxy paste engineered to achieve an exceptionally low thermal resistance of 5-7 x 10⁻⁶ K•m²/W, even when applied in bond lines as thin as 1...

FLASH24 International Overview Recent perovskite solar cell research demonstrates a significant advance, achieving a high power conversion efficiency of 27.39% through novel molecular design, alongside progress in resolving long-term sta...