Market Trends– category –
-
Epoxy Degradation Analysis: PCA-Based Spectral Mapping of 3 Curing Agents
Bioengineer.org USA Overview Researchers utilized principal component analysis (PCA) to link the complex spectral fingerprints of degrading filler-containing epoxy adhesives to the loss of mechanical strength. The study reveals that degr... -
Navitas UHV SiC Modules: 2300V G4H08MT23GB4 Specs and Reliability
Semiconductor Today USA Overview Navitas has introduced a 2300V ultra-high-voltage (UHV) SiC power module family featuring a class-leading 8mΩ R DSON. Utilizing fourth-generation GeneSiC Trench-Assisted Planar (TAP) architecture, these m... -
Technomelt Supra 130 Cool: Henkel’s 20% CO2 reduction specs
Henkel Germany Overview Henkel Adhesive Technologies introduced a comprehensive portfolio of sustainable packaging solutions at Interpack 2026, featuring the Technomelt Supra 130 Cool hotmelt adhesive. This product achieves a minimum 20%... -
Tata Electronics Invests $3 Billion in India’s First Semiconductor Packaging Facility, Partners with Besi to Boost Advanced Packaging
Tata Electronics India Overview Tata Electronics announced a $3 billion investment in India's first indigenous semiconductor packaging facility in Jagiroad, Assam, and a strategic partnership with advanced packaging equipment provider Be... -
Non-Woven Adhesives Market Grows; Bostik Expands APAO Production, Henkel Co-Develops Bio-Based Hot Melt
SNS Insider India Overview This article is an overview of a market research report published by SNS Insider. The non-woven adhesives market is experiencing growth, primarily driven by increasing demand from hygiene product manufacturers....
1