Market Trends– category –
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AI Infrastructure Component Crunch Becomes Reality: ABF Substrate Lead Times Hit 56 Weeks, Equipment Parts Up to 40 Months
BigGo Finance Taiwan Overview The supply shortage for AI infrastructure components is becoming entrenched; TrendForce reports ABF substrate lead times surged to 48–56 weeks, approximately 4 to 4.7 times the equilibrium. HDDs reached 50 w... -
AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption
PhotonCap Unknown Overview BESI has secured over 150 cumulative orders for its hybrid bonding systems, with six integrated production lines (including 30 BESI bonders) implemented by major logic customers in partnership with Applied Mate... -
ASE’s SPIL Nears Arizona Back-End Test Facility Expansion Amidst $10.5B CAPEX Surge; Amkor Boosts US Packaging Investment to $12B
TrendForce Taiwan Overview ASE subsidiary SPIL is finalizing plans for a new back-end test facility in Arizona, part of ASE's $10.5 billion CAPEX for 2026, which includes $4 billion for new facilities and $6.5 billion for equipment. Conc... -
CSIS Report: AI and HBM Demand Drive New Semiconductor Shortage, Highlighting Structural Shift and Supply Chain Security Concerns
CSIS USA Overview A CSIS report indicates that the current memory shortage reflects both structural demand growth from AI and cyclical market fluctuations. The rapid expansion of AI data centers has led to a surge in demand for HBM (High... -
Google Reportedly Considering CoWoS as Backup for 2027 TPUs Amid Intel EMIB-T Substrate Yield Lag Reports
No source name USA Overview Google's Humufish TPU project, slated for mass production by late 2027, is reportedly considering TSMC's CoWoS as a backup packaging solution, following reports of lagging substrate yields for Intel's EMIB-T t... -
Nvidia Chip Sales Projected to Double Next Year, Accelerating HBM4 Transition Amid TSMC CoWoS Packaging Bottleneck
No source name USA Overview Nvidia CEO Jensen Huang forecasts a doubling of Nvidia chip sales next year and an accelerated transition to HBM4, with TSMC's CoWoS advanced packaging identified as a primary shipping bottleneck. CoWoS is cru... -
Samsung Electronics Reorganizes Cheonan Plant for HBM Packaging, Outsourcing Mobile AP Backend Processes to Boost AI Memory Capacity
TrendForce South Korea Overview Samsung Electronics is reportedly reorganizing its Cheonan plant's backend operations to prioritize High Bandwidth Memory (HBM) packaging due to surging AI demand. This strategic shift involves phasing out... -
TSMC to Double CoWoS Advanced Packaging Capacity to 260,000 Wafers/Month by 2028, Driving OSAT and Intel Orders Amid Supply Crunch
BigGo Finance Taiwan Overview TSMC plans to double its CoWoS advanced packaging capacity from 130,000 wafers/month to 260,000 wafers/month by the end of 2028, primarily driven by surging AI chip demand. This expansion, centered on its AP...
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