Market Trends– category –
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CoPoS Packaging: TSMC and Samsung’s Shift to Panel-Level RDL
36Kr Europe China Overview The industry is shifting from CoWoS to CoPoS (Chip-on-Panel-on-Substrate) to overcome area utilization limits in GPU and HBM integration. By replacing circular wafers with rectangular panels up to 515×510mm, ma... -
Unimicron IC Substrate Outlook: Equipment Lead Times and 2027 Gap
TrendForce Taiwan Overview Unimicron warns of a critical IC substrate crunch characterized by equipment lead times stretching to 30 months and a projected 20% material supply gap by 2027. These bottlenecks, driven by AI accelerator deman... -
NXP Semiconductors: $250M EIB Global Loan for Malaysia Expansion
fundsforNGOs News USA Overview NXP Semiconductors is receiving a $250 million loan from EIB Global to expand semiconductor assembly, packaging, and testing capacity at its facility near Kuala Lumpur. The project, scheduled for completion... -
ERS electronic: Automated 310mm Panel-Level Packaging System Specs
Semiconductor Digest Germany Overview ERS electronic has launched a fully automated panel-level packaging (PLP) system for 310×310mm substrates that integrates bonding, debonding, and detaping. The platform achieves a throughput of 13 pa... -
ASE Technology Holding: Advanced Packaging Roadmap and 2027 Timeline
TechSoda USA Overview ASE has transitioned from traditional OSAT services to advanced packaging, with advanced packaging revenue growing from NT$18.8 billion in 2024 to NT$50.2 billion in 2025. The company is now implementing panel-level... -
Ibiden: 2027 server CPU substrate area and growth projections
FUNDA | Substack USA Overview Ibiden is leveraging its market position due to a severe shortage of qualified high-end ABF substrates, which cannot keep pace with the increasing area and layer counts of AI silicon. Server CPU shipments fr... -
Towa: $31.6M AI chip packaging factory and 2029 supply specs
Globtechwire Japan Overview Japanese semiconductor equipment manufacturer Towa announced plans to invest approximately ¥5 billion ($31.6 million) in a new factory in Kyoto Prefecture to meet increasing demand for advanced semiconductor p... -
AMD: Taiwan packaging and substrate capacity for 2027/2028
BigGo Finance Taiwan Overview AMD CEO Lisa Su visited Taiwan to secure advanced process technology, packaging, and substrate capacity for 2027 and 2028, ensuring smooth shipments of next-generation AI server products. While TSMC accelera... -
GlobalFoundries: $2B TSMC CoWoS interposer US production timeline
IDC Nova USA Overview GlobalFoundries and TSMC have signed a 5-year, $2 billion agreement for GlobalFoundries to manufacture silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. This strategic partnership will significantly... -
ASE Technology: AI revenue growth and 17.8B TWD fab specs
Seeking Alpha Taiwan Overview ASE Technology Holding (ASX) reported a significant acceleration in revenue and margin growth, driven by surging advanced packaging demand for AI and HPC. Q2 2026 saw a 26.7% year-on-year revenue increase, w...
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