NovoLINC Unveils MaxLINC, Achieving Industry-Leading 0.7 mm²•K/W Thermal Resistance for Multi-Kilowatt AI Chips

September 20, 2026

PR Newswire (NovoLINC) Unknown

Overview

NovoLINC has launched MaxLINC, an advanced thermal interface material (TIM) designed for high-performance AI computing, achieving an industry-leading thermal resistance as low as 0.7 mm²•K/W. This new TIM offers over 20% cooling energy savings for AI servers compared to current products, effectively addressing the critical thermal bottleneck in multi-kilowatt AI accelerators. NovoLINC is expanding operations to support the growing demand and commercialization of MaxLINC.

In Depth

Key Findings

NovoLINC has announced the launch of MaxLINC, an advanced thermal interface material (TIM) engineered specifically for high-performance AI computing, achieving an industry-leading thermal resistance as low as 0.7 mm²•K/W. This breakthrough product is capable of delivering over 20% cooling energy savings for AI servers compared to current industry offerings, thereby resolving a critical thermal bottleneck faced by multi-kilowatt AI accelerators.

Technical / Clinical Details

MaxLINC features a proprietary material design that ensures exceptionally high thermal conductivity and superior interfacial contact properties. The thermal resistance value of 0.7 mm²•K/W signifies its unparalleled efficiency in transferring heat from high-power components, such as CPUs and GPUs, to their respective heatsinks. This capability allows AI chips to operate at higher clock frequencies and maintain optimal junction temperatures, leading to enhanced stability, improved performance, and extended operational lifespans. The material’s superior thermal performance directly translates into significant reductions in power consumption for cooling systems, which is a major operational cost for data centers, especially given the exponential increase in power density of high-output AI chips.

Background & Context

The rapid advancements in artificial intelligence (AI) and high-performance computing (HPC) have led to a dramatic surge in processor power consumption and heat generation. For multi-kilowatt AI accelerators in particular, thermal management has emerged as a primary bottleneck limiting both performance and reliability. Traditional thermal interface materials have struggled to efficiently dissipate such extreme heat loads, often leading to system throttling, reduced lifespan, and increased risk of failure. MaxLINC’s introduction provides a much-needed solution to this pressing industry challenge, enabling the design and deployment of next-generation AI infrastructure.

Strategic Significance & Outlook

The deployment of MaxLINC is set to establish a new benchmark in AI chip cooling technology, significantly boosting the performance and energy efficiency of data centers and edge AI devices. NovoLINC is actively expanding its operations to meet the anticipated demand and facilitate the broad commercialization of this industry-leading TIM. MaxLINC is expected to be widely adopted across all applications requiring critical thermal management, including AI supercomputers, cloud servers, and autonomous driving systems. Its ability to enable more powerful and efficient AI hardware positions it as a foundational technology supporting the continued exponential growth and advancement of AI.

Source: https://www.prnewswire.com/news-releases/novolinc-launches-maxlinc-achieving-industry-leading-0-7-mmkw-thermal-resistance-for-multi-kilowatt-ai-chips-302882340.html

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