Semiconductor Back-End– category –
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Global Semiconductor Capital Investment to Surge 30% to $240 Billion in 2026, Driven by AI Inference Demand; Advanced Packaging Fuels Multi-Year Double-Digit Growth
Soka Technology Unknown Overview The global semiconductor industry is projected to enter an unprecedented capital investment supercycle in 2026, driven by a skyrocketing demand for AI inference capabilities. Industry forecasts estimate t... -
Intel Foundry Boosts AI Data Center Compute with Foveros and EMIB Advanced Packaging, EMIB-T Launch Planned for 2026
ET Datacenters India Overview Intel Foundry is actively deploying advanced packaging technologies, including Foveros stacking and Embedded Multi-die Interconnect Bridge (EMIB) interconnects, to meet the escalating demands of AI workloads... -
ASMPT’s Advanced Packaging Business Achieves Record H1 2026 Sales Driven by Surging AI Demand; Panel-Level Packaging Positioned as Key Future Growth Driver
ASMPT Corporate (Press Release) Hong Kong Overview ASMPT reported robust interim results for H1 2026, with its Advanced Packaging (AP) business achieving record sales, primarily fueled by the accelerating demand from the AI sector. The c... -
Samsung Electro-Mechanics Doubles Down on AI: Vietnam Plant to Lead Advanced Packaging Substrate Surge
Vietnam Korea Times Vietnam Overview Samsung Electro-Mechanics (SEMCO) is poised to significantly expand its production of advanced packaging substrates for AI semiconductors, with a reported 2.4-fold capacity increase at its Thai Nguyen... -
U.S. Commerce Department to Invest Up to $874 Million in Seven Semiconductor Companies Across AI, Advanced Packaging, and Supply Chain Security
AnySilicon USA Overview The U.S. Department of Commerce announced its intent to provide up to $874 million in incentives to seven semiconductor technology companies, targeting critical areas such as AI, advanced computing, semiconductor ... -
Applied Materials Significantly Upscales 2026 Advanced Packaging Growth Forecast to Over 70% as AI Chip Investment Shifts to HBM and Multi-Layer Integration
Xenospectrum USA Overview Applied Materials has substantially elevated its 2026 advanced packaging revenue growth forecast to over 70%, a 20-point jump from its previous 50%+ projection. This revision reflects a critical expansion of AI ... -
Samsung Electro-Mechanics Sees Semiconductor Package Substrate Utilization Rate Soar to 89%, Driven by AI Data Center Demand
연합뉴스 (Yonhap News) South Korea Overview Samsung Electro-Mechanics reported a significant increase in its semiconductor package substrate utilization rate, reaching an average of 89% in the first half of the year—a 19 percentage point... -
Samsung Electro-Mechanics Fast-Tracks Glass Substrates for AI Chip Packaging, Challenging Japanese Rivals for 2028 Mass Production
BusinessKorea South Korea Overview Samsung Electro-Mechanics (SEM) is accelerating its pursuit of glass substrates for AI chip packaging, targeting mass production by 2028 through its 'GlaSSEM' joint venture with Dongwoo Fine-Chem. This ... -
HBM Supply Crunch: Long Backlogs for Bonding Equipment and Low Yields Create Bottleneck, Constraining AI Demand Until 2027
AI CERTs News USA Overview HBM stack manufacturing demands Through Silicon Vias (TSV) and high-precision bonding equipment, with low yield tolerance posing an industry challenge. Limited vendors for these specialized tools mean HANMI, a ... -
IMAPS Device Packaging Conference 2026 Details 3D/2.5D Packaging Advances: FOPLP, Hybrid Bonding Drive Demand
IMAPS USA Overview Professional Development Courses at IMAPS Device Packaging Conference 2026 provided in-depth insights into current and future 3D/2.5D packaging processes and technologies. Key innovations like Fan-Out Panel Level Packa...
