Semiconductor Back-End– category –
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TSMC’s CoWoS Packaging Equipment Supply Chain Sees Robust Demand Amid AI Surge
DigiTimes Taiwan Overview TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging equipment supply chain is experiencing extremely strong demand, driven by the explosive growth of AI chips. Key equipment manufacturers are ramping up... -
Kioxia Accelerates Next-Gen Memory Mass Production Amid AI Boom, Poised for Dramatic Comeback
Channel News Asia Japan Overview Japanese memory semiconductor giant Kioxia is accelerating preparations for mass production of next-generation memory products, driven by the explosive demand for AI technology. The company aims to streng... -
Nomura Raises TSMC Target Price, Citing AI Infrastructure Cycle as Key Growth Driver
Futu News Taiwan Overview Nomura has upgraded TSMC's target price, attributing its strong growth to the accelerating AI infrastructure cycle. The surging demand for AI chips has led to TSMC's advanced packaging technologies, particularly... -
JCET Shares Soar on Major Investment in Advanced Chip Packaging Capabilities
Morningstar (Dow Jones News) China Overview Shares of China-based OSAT leader JCET Group surged following the announcement of a significant new investment in its advanced chip packaging capabilities. This investment aims to substantially... -
SK Hynix Announces Massive $64 Billion Investment in South Korea to Bolster AI Memory and Packaging Capabilities
Biggo Finance South Korea Overview SK Hynix has unveiled plans for a colossal $64 billion investment in memory chip and advanced packaging facilities within South Korea over the coming years. This strategic outlay aims to address the soa... -
BOE Commences Sample Shipments of Glass Substrates for Advanced Chip Packaging to Domestic Customers, Signaling Innovation Boost
36Kr English China Overview Chinese display giant BOE Technology has initiated sample shipments of glass substrates for advanced chip packaging to domestic customers. This move signifies China's technological progress in next-generation ... -
eWeek Reports on Critical AI Chip Bottlenecks: Advanced Packaging Identified as Key Solution
eWeek USA Overview A new eWeek report highlights that AI chip performance is confronting significant bottlenecks, deeming advanced packaging technologies essential for resolution. Critically, the scarcity of high-density integration tech... -
Samsung’s HBM4 Sales Projected to Surpass $10 Billion, Driven by Surging AI Demand
GuruFocus South Korea Overview Samsung Electronics' next-generation High Bandwidth Memory (HBM4) sales are forecast to exceed $10 billion this year, propelled by an explosive surge in AI demand. The company has made substantial investmen... -
Lam Research Forges Advanced Packaging Future with Wafer-to-Panel Processing Expansion
Lam Research Newsroom USA Overview Lam Research is actively shaping the future of advanced packaging by expanding its wafer-to-panel processing technologies. The company is developing new platforms and processes for larger panel substrat... -
AI Packaging Bottleneck Shifts: CoWoS, Wafer-Scale, and CoWoP Emerge as Key Solutions
EDN USA Overview The packaging bottleneck hindering AI chip performance is being addressed by advanced technologies such as CoWoS, wafer-scale packaging, and CoWoP. These innovations optimize the integration of AI processors and HBM by e...
