Semiconductor Back-End– category –
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TSMC’s CoWoS Bottleneck Threatens to Delay Google TPU Mass Production to 2027
専門メディア Taiwan Overview Chronic shortages in TSMC's CoWoS advanced packaging capacity are projected to delay mass production of Google's custom AI chips (TPU) until 2027. Despite TSMC's aggressive expansion plans targeting 120,000 w... -
TSMC Accelerates Advanced Packaging Capacity Expansion to Meet Exploding AI Demand
専門メディア Taiwan Overview TSMC is rapidly scaling its advanced CoWoS and SoIC packaging capacity to address the surging demand for AI chips. With 18 new fabs and advanced packaging facilities under construction globally, this expansio...
