Semiconductor Back-End– category –
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Hanmi Semiconductor Invests $92 Million in Largest-Ever 8th Plant for AI/HBM Demand, Enters U.S. Market
Pulse 2.0 South Korea Overview South Korean Hanmi Semiconductor is investing approximately 130 billion won (about $92 million) to construct its largest-ever 8th production facility, a direct response to the explosive demand for AI and Hi... -
China Invests 40 Billion Yuan ($5.5 Billion) in New Advanced Packaging Projects for AI/HPC to Prepare for Next Chip Shortage
All-About-Industries China Overview China's advanced packaging industry is embarking on a new wave of capacity expansion to meet the escalating demand for AI and High-Performance Computing (HPC) chips. Between May and July 2026, approxim... -
Hanmi Semiconductor Leads HBM4 TC Bonder Market, Diversifies Client Base with Micron Deals to Reduce SK Hynix Dependency
digitimes Taiwan Overview Hanmi Semiconductor has gained a significant lead over competitor Hanwha Semitech in the crucial thermal compression (TC) bonder market for High Bandwidth Memory (HBM) manufacturing. This market advantage is dri... -
SK Hynix Pioneers Optical Interconnects Beyond HBM, Outlines Roadmap for AI Bandwidth Challenges
Adalytica South Korea Overview SK Hynix is charting a course for optical chip connections that extend beyond High Bandwidth Memory (HBM) to address critical bandwidth limitations in large-scale AI systems. A recent Nature Electronics rev... -
HBM4 Breaks Bottlenecks: Hybrid Bonding Delivers 20%+ Thermal Reduction, 40% Power Efficiency Boost, 2.0TB/s+ Bandwidth
SemiHub.io International Overview HBM4, the next-generation High Bandwidth Memory, is set to significantly advance AI/HPC performance by doubling its I/O width to 2048 bits, targeting over 2.0 TB/s bandwidth per stack and substantial pow... -
SK Hynix Secures HBM4 Future: 70% Price Surge, 2026 Capacity Sold Out, and $3.87B US Investment for Advanced Packaging Independence
Adalytica and others South Korea Overview SK Hynix has signaled its dominance in the High Bandwidth Memory (HBM) market by reportedly increasing HBM4 prices by 70% for its 2026 supply, which is already entirely presold. Concurrent with t... -
Semiconductor Back-End Weekly Report August 16, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 16, 2026 (PDF) — Download Weekly Report August 16, 2026 (PDF) — DownloadDownload 🎙 Podcast August 16, ... -
TSMC Declares AI Advanced Packaging Competition Shifts to System-Level Reliability and Validation, Highlighting 3DIC Importance at OCP APAC 2026
digitimes Taiwan Overview At the OCP APAC 2026 summit, TSMC Vice President of Advanced Packaging Technology & Service, Jun He, announced that the escalating AI computing demand is rapidly increasing chip integration complexity, shift... -
Global Semiconductor Sales Soar 2.2x to Record $134.5 Billion in June 2026; TSMC Achieves Over 99% CoWoS Yield But Flags HBM and ABF Substrate Bottlenecks
Amiko Consulting Japan Overview Global semiconductor sales reached an unprecedented monthly high of $134.5 billion in June 2026, marking a 2.2-fold increase year-over-year, driven by a dramatic surge in AI data center investments across ... -
NXP to Double Malaysia Backend Capacity by Q1 2028; Resonac Reports 46% Growth in AI Backend Materials
note Japan Overview NXP Semiconductors has initiated construction of a new assembly and test (A&T) facility in Malaysia, projected to more than double the site's overall production capacity by Q1 2028 through advanced automation. Con...
