Semiconductor Back-End– category –
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South Korean Conglomerates Samsung and SK Group Invest $252.5 Billion in Chungcheong Province, Bolstering HBM Packaging and AI Semiconductor Supply Chain
The Korea Herald South Korea Overview South Korean giants including Samsung Electronics, SK hynix, and Celltrion announced a combined 392 trillion won (approximately $252.5 billion) investment in Chungcheong Province across semiconductor... -
Amkor Technology Commits $2.5B-$3.0B to Advanced Packaging Facilities for AI Demand, Arizona Plant Slated for 2028 Production
Hudson Labs USA Overview Amkor Technology plans a substantial capital expenditure of $2.5 billion to $3.0 billion for fiscal year 2026, driven by accelerating demand for advanced packaging in AI and data center computing. The investment ... -
Nvidia Kicks Off Volume Production of Blackwell AI Accelerators with TSMC’s CoWoS-L, Supply to Remain Tight Through Q4
MetalSemi Asia Taiwan Overview Nvidia has commenced volume production of its next-generation Blackwell AI accelerators at TSMC, leveraging the 4NP process and advanced CoWoS-L packaging. Cloud service provider demand is projected to outs... -
Lam Research Drives AI Performance with Advanced Packaging, Tackling Bottlenecks and Boosting Power Efficiency through Chiplets and Panel-Based Manufacturing
Lam Research USA Overview Lam Research highlights advanced packaging as the critical innovation frontier for AI, addressing the limitations of traditional semiconductor scaling. By enabling chiplets to function as a single system, this a... -
CHIPS Act Successfully Attracts Taiwanese Semiconductor Suppliers to US, Creating New Opportunities in Advanced Packaging and Materials Supply
Fidelity Investments USA Overview The U.S. CHIPS Act's $39 billion manufacturing incentives are successfully drawing Taiwan-based semiconductor manufacturers to the United States, providing concrete economic reasons for establishing new ... -
CXMT Confronts HBM Production Barriers: China’s Memory Ambitions Hinge on Yield and Advanced Packaging Breakthroughs by 2028
South China Morning Post China Overview Chinese DRAM manufacturer CXMT continues to grapple with significant technical challenges in establishing stable commercial production of High Bandwidth Memory (HBM), according to SemiAnalysis. Whi... -
Fraunhofer Develops DUV-Assisted Athermal Laser Grooving for Low-κ Dielectrics in Advanced Packaging
Karriere Fraunhofer-Gesellschaft Germany Overview Fraunhofer ILT is exploring a novel dual-pulse approach, DUV-assisted athermal laser grooving, for low-κ dielectrics in advanced microelectronics packaging. This technology temporarily ge... -
EU Chips Act Funds €210 Million for 3D IC Advanced Packaging, Benefiting Infineon, ASML Subsidiary, and Soitec
Qishuai-cn Germany Overview The European Commission announced its first EU Chips Act-funded project, allocating a total of €210 million to Germany's Infineon, an ASML subsidiary in the Netherlands, and France's Soitec. This funding is de... -
Samsung Pivots to HBM4, Hits $1B Sales Milestone, Eyes Optical HBM by 2028
Samsung South Korea Overview Samsung Electronics has aggressively pivoted half of its High Bandwidth Memory (HBM) production capacity to HBM4, achieving over $1 billion in sales within four months and projecting $10 billion annually by y... -
Applied Materials Unleashes Six New Systems to Turbocharge AI Chips with Advanced Packaging and Sub-10nm Defect Detection
Applied Materials USA Overview Applied Materials has launched six innovative systems to significantly accelerate the development and manufacturing of DRAM and advanced packaging for next-generation AI chips. These solutions tackle critic...
