Semiconductor Back-End– category –
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Rapidus Targets 600mm Panel-Level Packaging and 8-Reticle Interposers by 2030 for Advanced AI/HPC Systems
TrendForce Japan Overview Rapidus announced an accelerated advanced packaging roadmap aiming for 600mm panel-level packaging and 8-reticle interposers by 2030. The company has fully activated its Rapidus Chiplet Solutions (RCS) pilot lin... -
Google’s Next-Gen TPUs Adopt Intel EMIB Packaging, Achieve Yield Targets in First Mass Production
digitimes Taiwan Overview Google has successfully implemented Intel's Embedded Multi-die Interconnect Bridge (EMIB) packaging technology for mass production of its next-generation TPUs, already achieving yield targets. This strategic mov... -
Semiconductor Back-End Weekly Report August 22, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 22, 2026 (PDF) — Download Weekly Report August 22, 2026 (PDF) — DownloadDownload 🎙 Podcast August 22, ... -
Lens Technology Enters Advanced Chip Packaging with Self-Developed Through-Glass Vias (TGV) Substrates and Dedicated 30,000sqm Factory
Chinadaily.com.cn China Overview Chinese smartphone glass screen manufacturer Lens Technology has announced its entry into the advanced chip packaging market, driven by AI chips pushing traditional material limits. The company showcased ... -
Henkel Launches LOCTITE ABLESTIK CDF900 Conductive Die Attach Film with Over 8 W/m-K Thermal Conductivity for High-Power AI Packages
Henkel Germany Overview Henkel has introduced the LOCTITE ABLESTIK CDF900 series conductive die attach film to address thermal management challenges in high-power AI packages. This new product significantly boosts thermal conductivity to... -
HANMI Semiconductor Invests $91.4 Million in Largest-Ever 8th Production Facility in Incheon to Meet Soaring AI Chip Demand
Business Wire South Korea Overview HANMI Semiconductor is investing $91.4 million (approximately 130 billion KRW) to establish its largest-ever 8th production facility in Incheon, by acquiring Mercury Co., Ltd.'s factory, to proactively ... -
Sumitomo Bakelite and Mitsubishi Chemical Raise Packaging Material Prices for CoWoS and HBM Amid Surging Demand
Global Times China Overview Increasing demand for advanced processes and packaging, coupled with rising energy and raw material costs from Middle East conflicts and China's tightened export controls on strategic minerals, is disrupting h... -
Morgan Stanley Taps Samsung Electro-Mechanics as Top Korean Tech Pick Amid Surging AI Chip Substrate Demand
Evrim Ağacı Turkey Overview Morgan Stanley has elevated Samsung Electro-Mechanics to its premier Korean tech stock, citing the escalating technical demands of AI chip designs on advanced substrates. As AI processors become larger, multi-... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
Japan’s Shinko Electric Develops 22-Layer Glass Substrates for AI Chips, Resolving Internal Cracking and Delamination Issues
TrendForce Japan Overview As AI chips demand larger packages, intensifying competition in glass substrates, Japan's Shinko Electric Industries has successfully developed 22-layer glass substrates with 11 copper wiring layers on each side...
