Semiconductor Back-End– category –
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Amkor Technology Expands Arizona Campus with 67-Acre Acquisition, Bolstering U.S. Advanced Packaging OSAT Capacity
AllMind AI News USA Overview Amkor Technology has acquired an additional 67 acres in Arizona to significantly expand its U.S. advanced semiconductor packaging and test capacity. This expansion, supported by up to $407 million in CHIPS Ac... -
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
Applied Materials Unveils Seven New Systems for AI Chip DRAM Performance and Advanced 3D Packaging, Accelerating Bottleneck Resolution
Industry News International Overview Applied Materials introduced seven new semiconductor manufacturing systems designed to address bottlenecks in AI chip production, specifically enhancing DRAM performance scaling and advanced 3D packag... -
ASE Initiates Largest-Ever Global Expansion to Double CoWoS Capacity to 45,000 Wafers/Month by Late 2027
Industry Blog/Analysis International Overview ASE is undertaking its largest global factory expansion in history, commencing construction of six new packaging and testing plants in 2026. This aggressive ramp aims to increase monthly CoWo... -
Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift... -
Semiconductor Back-End Weekly Report July 12, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report July 12, 2026 (PDF) — Download Weekly Report July 12, 2026 (PDF) — DownloadDownload 🎙 Podcast July 12, 2026 (... -
SK Hynix to Heavily Invest in ASML EUV for HBM Production in Yongin and Cheongju, Expanding Indiana Packaging Facility
Seeking Alpha South Korea Overview SK hynix plans to extensively deploy ASML's EUV (Extreme Ultraviolet) lithography equipment at its Yongin Semiconductor Cluster and Cheongju advanced packaging facilities, significantly bolstering High-... -
Semiconductor Industry Pivots to Heterogeneous Large-Scale Integration (HLSI) as AI Reshapes Chip Design
Next Move Strategy Consulting (via EE Times) USA Overview Driven by surging AI workloads, the semiconductor industry is dramatically shifting beyond traditional System-on-Chip (SoC) paradigms towards Heterogeneous Large-Scale Integration... -
Micron’s HBM Order Book Fully Committed Through 2028, Secures Silicon Wafer Supply with 10-Year GlobalWafers Offtake Agreement
Investing.com USA Overview Micron Technology's High-Bandwidth Memory (HBM) order book is fully committed through 2026 and 2027, with customer bookings extending into 2028, clearly indicating that supply, not demand, is the binding constr... -
China’s Memory Industry Accelerates HBM3/3E Development; YMTC Leads in Wafer-to-Wafer Hybrid Bonding Patents
BloomingBit.io China Overview China's memory industry is rapidly advancing, with companies like CXMT focusing on HBM3 and HBM3E development, thereby narrowing the technology gap with South Korea. Notably, Yangtze Memory Technologies Co. ...
