Semiconductor Back-End Weekly Report May 24, 2026

Semiconductor Back-End Weekly Report July 19, 2026

Samsung Electro-Mechanics Challenges Ibiden in AI Server Package Substrates with FC-BGA and Glass Substrate Push

Micron Invests $500M in GlobalWafers Texas Plant, Targets 40% US DRAM Production by 2035

Applied Materials Fortifies AI Advanced Packaging with 10-Year TSMC Pact and NEXX Acquisition

Samsung Electronics Advances “2.xD” Packaging Integrating HBM, Logic, and Optical Tech to Resolve AI Power and Heat Bottlenecks

Malaysia Launches RM92 Million Government-Backed Initiative to Develop HBM4 Advanced Packaging Pilot Line, Targeting Higher Semiconductor Value Chain

AT&S to Invest €1.5-2 Billion in Malaysian ABF Capacity, While IBIDEN Allocates ¥500 Billion for AI/HPC Substrate Expansion in Japan & Overseas

Taiwan’s TGV Glass Substrate Supply Chain Advances: E&R Engineering Ships Laser Modification Equipment to US Client, Accelerating Mass Production