Hanmi Semiconductor Forecasts HBM4 TC Bonder Rebound in Q2, Announces US Expansion Plans

BigGo Finance South Korea

Overview

Hanmi Semiconductor anticipates a significant rebound in HBM4 TC bonder orders from Q2 2026, driven by accelerating AI semiconductor demand, despite a Q1 slump during the HBM3E-to-HBM4 transition. The company projects record full-year revenues and operating profits. To support global supply chains, including Micron, SK Hynix, and Tesla’s US fabs, Hanmi plans a ₩100 billion ($66 million) investment in its Plant 7 and the establishment of “Hanmi USA” in San Jose, reinforcing its position as a global leader in HBM TC bonder technology.

In Depth

Surging HBM4 Demand and Hanmi Semiconductor’s Strategy

High Bandwidth Memory (HBM) is experiencing explosive demand as a core component of AI accelerators. The next generation, HBM4, requires advanced Thermo-Compression (TC) bonding technology to achieve even higher bandwidth and stacking density. Hanmi Semiconductor, a global leader in the TC bonder market, forecasts a substantial rebound in HBM4 TC bonder orders starting from Q2 2026. This resurgence is attributed to the continuous growth of the AI semiconductor market and the accelerating transition to HBM4 technology. Despite a temporary dip in Q1 revenues due to a transition gap from HBM3E to HBM4, the company maintains a bullish full-year outlook, projecting record financial performance.

Global Expansion and Focus on the US Market

To meet the escalating HBM demand, Hanmi Semiconductor is pursuing a strategy to strengthen its global production capacity and service infrastructure. As part of this initiative, the company is making a significant investment of ₩100 billion (approximately $66 million USD) in its Plant 7 in South Korea to expand production capabilities. Furthermore, Hanmi announced plans to establish “Hanmi USA” in San Jose, aiming to bolster its presence in the American market. This US outpost will reinforce support for key customers’ American facilities, including Micron, SK Hynix, and Tesla, and deepen collaboration with local supply chains. This expansion in the US aligns with the broader trend of semiconductor supply chain re-alignment driven by geopolitical considerations.

Importance of HBM TC Bonder Technology and Future Outlook

As HBM stacking density increases and requires finer-pitch chip integration, TC bonders are critical equipment for determining HBM performance and reliability. Hanmi Semiconductor’s technology is key to meeting these advanced requirements and enabling high-volume HBM production. The company’s aggressive investment and global expansion strategy aim to capitalize on the growth of the HBM market, seeking future revenue growth and further market share expansion. As long as AI technology continues to evolve, HBM demand is expected to remain robust, and consequently, the importance of advanced packaging equipment manufacturers like Hanmi Semiconductor will continue to rise. Specifically, the ability to address next-generation HBM beyond HBM4 will be a major determinant of the company’s long-term growth.