Semiconductor Back-End– category –
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GlobalFoundries Triples Malta Fab Capacity with $16 Billion US CHIPS Act Investment, Targeting 1.5 Million Wafers/Year by late 2028
Tom's Hardware USA Overview GlobalFoundries is advancing a $16 billion US investment plan, bolstered by the CHIPS Act, to triple production capacity at its Malta fab. This includes an 11 billion Euro expansion at its Dresden plant, aimin... -
Hiwin and Qualcomm Integrate Edge AI into Panel-Level Semiconductor Packaging to Enhance Production Accuracy and Throughput
Packnode Taiwan Overview Taiwanese motion control specialist Hiwin Technologies is collaborating with Qualcomm to integrate Dragonwing Q6 Edge AI into panel-level semiconductor packaging (PLP) equipment. This partnership combines machine... -
Dow Showcases Next-Gen AI Thermal Management Technologies at COMPUTEX Taipei 2026, Supporting 400G+ Optical Transceivers
chemXplore USA Overview Dow showcased next-generation thermal management technologies for AI servers and high-speed optical transceivers at COMPUTEX Taipei 2026. The company presented thermal interface materials (TIMs) and silicone-based... -
Amkor Technology Acquires 67 Additional Acres in Arizona, Expanding U.S. Advanced Packaging Footprint
Dataquest Bureau USA Overview Amkor Technology has secured an additional 67 acres adjacent to its existing campus in Peoria, Arizona, to significantly expand its U.S. advanced semiconductor packaging and test capabilities. This strategic... -
Applied Materials Achieves Record $7.91 Billion Revenue in Q2 2026, Advanced Packaging Business to Accelerate Over 50% for AI
MLQ.ai USA Overview Applied Materials reported record revenue of $7.91 billion in Q2 2026, marking a 13% sequential and 11% year-over-year increase, with non-GAAP gross margin reaching 50%, an 80 basis point improvement. The company anti... -
AMD Announces Over $10 Billion Taiwan Ecosystem Investment to Bolster AI Infrastructure and Advanced Packaging Manufacturing
Electronics Engineering Herald - EEHerald USA Overview AMD announced an investment exceeding $10 billion in Taiwan's ecosystem to expand its AI infrastructure and advanced packaging manufacturing capabilities. This significant capital in... -
CEA-Leti Demonstrates 1µm Pitch Die-to-Wafer Hybrid Bonding, Addressing AI Hardware Bottlenecks
Chiplet Marketplace France Overview CEA-Leti announced a significant advancement at ECTC 2026, demonstrating functional test vehicles utilizing die-to-wafer (D2W) hybrid bonding down to 1µm pitch, poised to resolve critical AI hardware b... -
Intel to Build $3.3 Billion Glass Core Substrate Manufacturing Facility in India to Bolster Advanced Packaging Supply
TrendForce USA Overview Intel, in collaboration with 3D Glass Solutions (3DGS), is progressing with plans to invest approximately $3.3 billion in an advanced packaging glass core substrate manufacturing facility in Odisha, India. The pla... -
Samsung Electronics Begins Shipment of Industry’s First 12-Layer HBM4E Samples, Improving Energy Efficiency by 16% and Thermal Resistance by 14% Over HBM4
Samsung Electronics South Korea Overview Samsung Electronics has commenced shipments of industry-first 12-layer HBM4E samples to key global customers. This HBM4E improves energy efficiency by 16% and thermal resistance by over 14% compar... -
Imec and EV Group Set New World Record for 3D Chip Stacking Precision with Sub-40nm Wafer Bond Overlay
PR Newswire ベルギー Overview Imec and EV Group have achieved a world-record post-bond overlay accuracy of less than 40 nanometers across a 300mm wafer for 200nm pitch hybrid bonding, a crucial advancement for next-generation 3D ICs. Dem...
