Semiconductor Back-End– category –
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Powertech Aims for Early 2027 Launch of World’s First AI Server Panel-Level Packaging Mass Production
Tonarism Taiwan Overview Powertech Technology, a leading Taiwanese OSAT, has unveiled plans to commence mass production of panel-level packaging (PLP) for AI semiconductors and server CPUs by early 2027. This initiative establishes the w... -
Scientech Forecasts 50% Shipment Growth Driven by AI Demand, Targets Next-Gen CoPoS Market Entry
Taipei Times Taiwan Overview Scientech, a Taiwanese supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-over-year increase in shipments this year, fueled by robust AI application demand and rapid technol... -
TSMC Establishes Kaohsiung Advanced Packaging Cluster, Aims for Up to 50% Efficiency Gains
digitimes Taiwan Overview TSMC announced the establishment of an advanced packaging materials and equipment supply chain cluster in Kaohsiung's Baipu Industrial Park, Taiwan. This strategic move aims to enhance efficiency in advanced pac... -
Taiwan and Lithuania Ink €5.6M Tech Pact to Develop Advanced Packaging Machinery for Next-Gen Chips
Taiwan News Taiwan Overview Taiwan and Lithuania have signed an MOU to jointly develop advanced packaging machinery for next-generation chips, committing €5.6 million (approx. $6.5 million USD) over two years in a public-private partners... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS... -
Semiconductor Back-End Weekly Report August 30, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 30, 2026 (PDF) — Download Weekly Report August 30, 2026 (PDF) — DownloadDownload 🎙 Podcast August 30, ... -
Glass Substrates in Advanced Packaging Accelerate from Prototype to Mass Production, Emerging as Key Technology for HBM and Chiplet Integration
Solid State Technology USA Overview Advanced packaging technology utilizing glass substrates is rapidly transitioning from R&D to mass production within the semiconductor industry. Glass substrates, superior to conventional organic s... -
STMicroelectronics Unveils Modular SiP Solution for Automotive AI Market, Driving Miniaturization and Performance in Autonomous Driving and ADAS
Electronics Weekly Switzerland/France Overview STMicroelectronics has launched a new modular System-in-Package (SiP) solution specifically designed for automotive AI applications. This solution integrates multiple chips to reduce footpri... -
Infineon Strengthens Advanced Packaging Collaboration in Europe under EU Chips Act, Building Chiplet and Heterogeneous Integration Supply Chain
Reuters Germany Overview Infineon announced strengthened partnerships for advanced packaging technology development within Europe, leveraging the EU Chips Act. This strategy aims to build an indigenous supply chain for chiplet technology...
