Semiconductor Back-End Weekly Report May 7, 2026

Semiconductor Back-End Weekly Report September 13, 2026

Korea and Taiwan Surge as Semiconductor Equipment Investment Hubs, Driven by HBM and Advanced Packaging in H1 2026

Laser Debonding Technology Becomes Critical for Improving Thin Wafer Yield in HBM and Hybrid Bonding

Taiyo Holdings and imec Unveil 700nm 3-Layer RDL Breakthrough for Next-Gen AI Packaging

South Korea Accelerates Advanced Packaging Investments, Establishing Itself as Core of Global AI Semiconductor Supply Chain

Applied Materials Forecasts Over 70% Growth in Advanced Packaging Revenue, Total Revenue Up 40%, Driven by AI and HBM Demand

Onto Innovation’s Advanced Packaging Business Achieves 80% Growth, Driven by Dragonfly G5 for HBM4 and 2.5D AI

KLA Achieves $1.1 Billion in Advanced Packaging Process Control Revenue, Driven by Surging AI Chip Demand