Semiconductor Back-End– category –
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TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
Korean Tech Giants Accelerate AI Substrate Production Amid Soaring Demand, Nearing 90% Utilization
TrendForce Taiwan Overview The proliferation of AI data centers has created a critical shortage and driven up prices for advanced substrates essential for GPUs and HBM. In response, Samsung Electro-Mechanics (SEM) and LG Innotek are aggr... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the... -
KLA’s Advanced Packaging Business Set for $1.1 Billion Revenue, 70%+ Growth Driven by AI Demand and Yield Bottleneck Resolution
Quartz USA Overview KLA is significantly benefiting from accelerating demand for advanced packaging inspection, metrology, and process control tools due to the increasing complexity of AI/HPC chips and hybrid bonding advancements. Its ad... -
Intel’s EMIB-T Advanced Packaging Projected for Significant Contribution by 2029 as CoWoS Constraints Drive Google’s Interest
TrendForce Taiwan Overview Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology, particularly EMIB-T, is attracting strong interest from major tech firms like Google amid persistent TSMC CoWoS supply constraints. Intel projec... -
AI Supply Chain Maxed Out: 40-Week Lead Times Become New Normal as HBM Emerges as Primary Bottleneck Over TSMC CoWoS
Markets Insider USA Overview The AI supply chain faces severe constraints, with 40-week lead times becoming the new norm. High Bandwidth Memory (HBM) has replaced TSMC's CoWoS advanced packaging as the primary bottleneck, driven by NVIDI... -
Applied Materials Launches New HBM & 3D Packaging Systems, Acquires ASMPT NEXX to Scale AI Compute
Exoswan Insights USA Overview Applied Materials has introduced new CMP, ECD, deposition, and e-beam systems for HBM and 3D packaging, alongside acquiring ASMPT's NEXX business, to capitalize on the escalating demand for AI computing. The... -
AI Inference and China’s Strategic Investments Ignite Semiconductor Manufacturing Boom, Propelling Silicon Wafer Recovery
Electronic Device Industry News Japan Overview The semiconductor manufacturing equipment and materials market is experiencing an unexpected boom, fueled by surging demand for inference AI and significant renewed investment from China. Ev... -
AI Boom Spurs China’s Top OSATs to Pour Billions into Advanced Packaging
Digital Today China Overview China's three leading OSAT firms—JCET, Tongfu Microelectronics, and Huatian Technology—have reported significant profit surges in H1 2026, largely due to escalating AI semiconductor demand. In response, these...
