Semiconductor Back-End– category –
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NXP Unveils Plan to More Than Double Malaysian Semiconductor Back-End Capacity Amid Surging Global Demand
Japanese Semiconductor Manufacturing Equipment Malaysia Overview NXP has announced a substantial expansion of its Malaysian facility, targeting a more than twofold increase in semiconductor back-end production capacity. This strategic in... -
Samsung Dedicates Half of Its 4nm Foundry Capacity to HBM4 Base Dies Amid AI Boom
ZDNet Korea South Korea Overview Samsung Electronics is reportedly allocating over 50% of its advanced 4nm foundry capacity—specifically 15,000 wafers per month out of an estimated 30,000 total—to the production of HBM4 base dies. This s... -
Hybrid Bonding Equipment Market Projected to Reach $1.73 Billion in 2026, Growing to $2.58 Billion by 2032
360iResearch Global Overview This article provides an overview of a market research report published by 360iResearch. The hybrid bonding equipment market is projected to reach $1.73 billion in 2026, with a compound annual growth rate (CA... -
Micron Reportedly Targets Doubling HBM Capacity to 100,000 Wafers/Month by End-2026, Boosting 12-High HBM4 for NVIDIA Vera Rubin
digitimes USA Overview Micron is reportedly targeting a near-doubling of its High Bandwidth Memory (HBM) production capacity to approximately 100,000 wafers per month by the end of 2026. This significant expansion focuses on ramping up p... -
Samsung Electro-Mechanics Unveils Five Next-Gen Semiconductor Package Substrate Products for AI, Automotive, and Mobile Markets at KPCA Show
Global Sources South Korea Overview Samsung Electro-Mechanics showcased next-generation semiconductor package substrate technologies at KPCA Show, targeting high-end chip applications like AI servers, automotive systems, and mobile devic... -
Broadcom CEO Warns of Critical Substrate Bottleneck for AI Chips; Toppan Subsidiary Builds Advanced FC-BGA Plant in Singapore
Industry Media Global Overview Broadcom CEO Hock Tan has identified advanced packaging substrates as a critical new bottleneck for high-end chip production, particularly for demanding AI accelerators and network processors, alongside adv... -
API Unveils GEMINI PRO, NUERA PRO, and AP-M3500 Bonding Platforms for Next-Gen Semiconductors at SEMICON Taiwan 2026, Addressing Key Packaging Bottlenecks
API (Advanced Packaging Intelligence) Unknown Overview API (Advanced Packaging Intelligence) reported a successful exhibition of next-generation advanced packaging technologies at SEMICON Taiwan 2026. Their GEMINI PRO, NUERA PRO, and AP-... -
Samsung Unveils 3D-Stacked Memory Strategy, Featuring HBM5, zHBM, and zNAND-O, to Break AI’s Memory Wall
Design And Reuse South Korea Overview At SEMICON Taiwan 2026, Samsung Electronics presented a bold 3D-stacked memory strategy designed to overcome the limitations of current memory architectures in the AI era. This roadmap introduces HBM... -
Taiwan’s MOEA Unveils 29 Cutting-Edge Semiconductor Innovations, Including Double-Sided RDL Process for CoPoS Packaging at SEMICON Taiwan 2026
Ministry of Economic Affairs (MOEA) Taiwan Overview Taiwan's Ministry of Economic Affairs (MOEA) showcased 29 cutting-edge technology innovations at SEMICON Taiwan 2026, encompassing advanced packaging, AI data center power management, a... -
Taiwan and Lithuania Ink €5.6 Million MOU for Joint Development of Next-Gen Advanced Packaging Technologies
CNA / Taiwan News Taiwan Overview Taiwan and Lithuania have signed an MOU for joint development of advanced packaging equipment for next-generation chips, backed by €5.6 million (NT$205 million) in government funding over two years. This...
