Semiconductor Back-End– category –
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Semiconductor Back-End
Semiconductor Engineering June 2026 Report Highlights On-Chip Photonics, Hybrid Bonding, and GaN for AI/HPC
Semiconductor Engineering USA Overview Semiconductor Engineering's June 2026 issue features on-chip photonics for AI systems, enhanced connectivity via hybrid bonding, new GaN power device designs, and managing manufacturing variations a... -
Semiconductor Back-End
TSMC to Halve AI Chip Supply Gap from 20% to 10% by End-2026 with CoWoS Capacity Boost; Next-Gen CoPoS on Track
TrendForce Taiwan Overview TSMC is projected to halve the AI chip supply-demand gap from approximately 20% to 10% by the end of 2026 through aggressive expansion of its CoWoS advanced packaging capacity. The company's monthly CoWoS produ... -
Semiconductor Back-End
Malaysia Commits RM185M to Advanced Packaging Consortium, Targeting High-Value AI and HPC Semiconductors
不明 Malaysia Overview Malaysia has initiated the "Malaysia Advanced Packaging Consortium (MAPC)" with a substantial RM185 million (~$39.5M USD) investment, aiming to strategically pivot its semiconductor industry towards higher-value ac... -
Semiconductor Back-End
Nokia Ramps Up U.S. Advanced Chip Packaging Capacity Tenfold in Pennsylvania to Fuel AI Networks
Cyprus Shipping News キプロス Overview Nokia is significantly expanding its U.S. advanced semiconductor test and packaging operations in Allentown, Pennsylvania, targeting a tenfold increase in domestic production capacity for optical ne... -
Semiconductor Back-End
AI Infrastructure Demand Intensifies Memory Shortage: TSMC CoWoS Constraints and Vietnam Labor Shortages Create Compound Challenges
Sourceability USA Overview Rising AI infrastructure demand is generating new challenges across the semiconductor supply chain, notably a worsening memory shortage. TSMC's CoWoS packaging limitations are expected to persist with the AI bo... -
Semiconductor Back-End
TSMC and Amkor Sign 10-Year Advanced Packaging Deal in Arizona, Amkor to Invest $7B for CoWoS Supply Boost and US Ecosystem Build-out
Bignewsnetwork India Overview TSMC and Amkor have signed a 10-year strategic agreement to expand semiconductor packaging capabilities in Arizona, USA. This partnership focuses on cutting-edge packaging technologies, including TSMC's InFO... -
Semiconductor Back-End
imec Unleashes High-Density MIMCAP RF Interposer for D-Band Millimeter-Wave and Sub-THz Communications, Accelerating III-V Chiplet Integration
imec ベルギー Overview imec has unveiled a high-density MIMCAP RF interposer specifically engineered for demanding D-band and sub-THz wireless front-ends, alongside hundreds of gigahertz data center links. This innovative platform priori... -
Semiconductor Back-End
TSMC’s CoWoS Shortage Eases, But Bottleneck Shifts to ‘Hyper-Scale Packaging’ as Google Reportedly Engages Samsung for TPU Production
Zhitong Finance APP Hong Kong Overview Reports suggest Google is in discussions with Samsung Electronics regarding the production of specific hardware components for its AI training and inference Tensor Processing Units (TPUs), highlight... -
Semiconductor Back-End
Park Systems and imec Forge Alliance for Next-Gen 3D Packaging and Logic Metrology
imec Official Press Release ベルギー Overview Nano-metrology leader Park Systems has launched a two-year Joint Development Program (JDP) with imec, a global semiconductor research powerhouse. The partnership focuses on creating cutting-e... -
Semiconductor Back-End
ASE Technology Raises 2026 LEAP Revenue Outlook Above $3.5 Billion, Driven by Soaring AI Advanced Packaging Demand
Zacks USA Overview ASE Technology Holding expressed strong confidence in its Leading Edge Advanced Packaging (LEAP) business trajectory, raising its 2026 LEAP revenue outlook by 10% to over $3.5 billion. This upward revision explicitly r...