Semiconductor Back-End– category –
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TrendForce Analyzes: 18 Chinese Enterprises Accelerate Positions in Glass Core Substrate Market
TrendForce Taiwan Overview TrendForce reported that 18 Chinese companies are rapidly enhancing their presence in the glass core substrate market for advanced packaging. This movement is part of China's strategy to achieve supply chain au... -
South Korea Unveils Major Investment Plan to Boost National Competitiveness in Advanced Packaging
Maeil Business Newspaper (MK.co.kr) South Korea Overview The South Korean government announced a large-scale investment plan to enhance national competitiveness in advanced packaging. This strategy aims to meet surging demand for AI and ... -
ASE Technology Raises 2026 CapEx to Record US$10.5 Billion, Targets 2x Advanced Packaging Revenue by 2027
TrendForce Taiwan Overview TrendForce reports that ASE Technology Holding, the world's largest OSAT company, plans to raise its 2026 capital expenditure (CapEx) to a record US$10.5 billion. The company aims to double its revenue from adv... -
TrendForce Reports TSMC Expanding CoWoS Front-End Outsourcing to OSATs Amid Surging NVIDIA ASIC Demand
TrendForce Taiwan Overview TrendForce reports that TSMC is reportedly expanding the outsourcing of key front-end processes for its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging to OSATs (Outsourced Semiconductor Assembly and Test... -
Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026 in Suwon, Korea, to Cover Advanced Packaging, Chiplets, and HBM
Advanced Semiconductor Packaging & Chiplet Show (ASPS) South Korea Overview The Advanced Semiconductor Packaging & Chiplet Show (ASPS) will take place from August 26-28, 2026, at the Suwon Convention Center in South Korea. This B2B e... -
Glass Substrates Emerge as AI Packaging Game-Changer, Igniting Global Race Towards Mass Production as China and Japan Intensify Competition for Yield Stabilization
The Economy South Korea Overview As AI semiconductor competition shifts from process-node miniaturization to advanced packaging, China and Japan are intensifying efforts to lead the glass core substrate market, a cornerstone for next-gen... -
IMAPS Device Packaging Conference 2026 PDCs Focus on Advanced Packaging for Chiplets and Heterogeneous Integration, Highlighting Hybrid Bonding
IMAPS USA Overview IMAPS Device Packaging Conference 2026 Professional Development Courses (PDCs) extensively covered "Advanced Packaging for Chiplets and Heterogeneous Integration." The courses defined various 2D to 3.5D IC integrations... -
ACM Research Secures Production and Evaluation Orders for Ultra ECP ap-p Horizontal Panel Electroplating Tool, Supporting 600x600mm Panels
GlobeNewswire USA Overview ACM Research announced securing production and evaluation orders from two advanced packaging customers for its Ultra ECP ap-p horizontal panel-level electroplating tool. This innovative tool supports large pane... -
AI’s Performance Breakthrough: Advanced Packaging, Power, and Interconnects Take Center Stage at SEMI Europe 2026
SEMI Europe Europe Overview SEMI Europe's 2026 Advanced Packaging Conference (APC) will spotlight 'Power and Interconnects Innovations Enabling AI System Performance,' emphasizing advanced packaging (AP) and test as crucial for scaling n... -
Semiconductor Back-End Weekly Report August 2, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 02, 2026 (PDF) — Download Weekly Report August 02, 2026 (PDF) — DownloadDownload 🎙 Podcast August 02, ...
