Semiconductor Back-End– category –
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Semiconductor Back-End Weekly Report September 13, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report September 13, 2026 (PDF) — Download Weekly Report September 13, 2026 (PDF) — DownloadDownload 🎙 Podcast Septe... -
Korea and Taiwan Surge as Semiconductor Equipment Investment Hubs, Driven by HBM and Advanced Packaging in H1 2026
The Information Network USA, South Korea, Taiwan Overview In the first half of 2026, global semiconductor equipment sales witnessed a significant geographical pivot, with South Korea (up 32.4%) and Taiwan (up 24.0%) emerging as primary g... -
Laser Debonding Technology Becomes Critical for Improving Thin Wafer Yield in HBM and Hybrid Bonding
Microtreat Global Overview Laser debonding is gaining importance as the cleanest and least damaging wafer separation technology for high-value 3D integration and advanced packaging. For ultra-thin wafers (20-50 micrometers) in HBM, chipl... -
Taiyo Holdings and imec Unveil 700nm 3-Layer RDL Breakthrough for Next-Gen AI Packaging
Quantum Zeitgeist Japan, Belgium Overview Taiyo Holdings, in collaboration with imec, announced at IEEE ESTC 2026 the successful formation of a 3-layer Redistribution Layer (RDL) with a critical dimension of 700 nanometers on 12-inch waf... -
South Korea Accelerates Advanced Packaging Investments, Establishing Itself as Core of Global AI Semiconductor Supply Chain
Investment Monitor South Korea, USA Overview South Korea is significantly boosting its advanced packaging investments to meet surging AI semiconductor export demand. SK Hynix plans to complete a ₩19 trillion ($12.9 billion) advanced pack... -
Applied Materials Forecasts Over 70% Growth in Advanced Packaging Revenue, Total Revenue Up 40%, Driven by AI and HBM Demand
TradingKey USA Overview Applied Materials projects approximately 40% growth in its total revenue for 2026, benefiting significantly from the increasing complexity in AI chip and HBM manufacturing. The company anticipates over 70% growth ... -
Onto Innovation’s Advanced Packaging Business Achieves 80% Growth, Driven by Dragonfly G5 for HBM4 and 2.5D AI
Investing.com USA Overview Onto Innovation announced its advanced packaging business grew by 80% year-over-year in 2026, fueled by robust demand from HBM and 2.5D logic applications. The company's Dragonfly G5 platform has been adopted f... -
KLA Achieves $1.1 Billion in Advanced Packaging Process Control Revenue, Driven by Surging AI Chip Demand
Quartz USA Overview KLA projects approximately $1.1 billion in revenue from its advanced packaging process control systems in 2026, marking over 70% year-over-year growth, driven by the increasing complexity of AI and HPC chips. The shif... -
High-End ABF Substrate Supply Faces Critical Shortage Amid Gigantic AI Chip Growth, Fueling Intense Competition Among Taiwanese Manufacturers
Tom's Hardware Taiwan Overview The escalating computational power and physical size of AI chips have led to a severe global shortage in the supply of high-end Ajinomoto Build-up Film (ABF) substrates, a core component. In response, inten... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging Mass Production
Asianews.network Germany Overview Germany's TRUMPF announced a breakthrough in Through Glass Via (TGV) coating for glass substrates, a critical bottleneck, by leveraging its high-power HiPIMS (High Power Impulse Magnetron Sputtering) tec...
