Semiconductor Back-End– category –
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UCIe 3.0 explained: PCIe chiplet integration for AI and HPC
Verification Horizons USA Overview Universal Chiplet Interconnect Express (UCIe) 3.0 is transforming PCIe implementation by providing a standardized interconnect for optimized die-to-die communication in chiplet architectures. This enabl... -
Samsung HBM4: 2027 production specs and glass carrier volume
BigGo Finance South Korea Overview Samsung Electronics plans to at least double its HBM4 family production next year, with glass carrier outsourcing for cleaning expanding 2.5-fold from 20,000 to 50,000 wafers per month. HBM4 yield has s... -
TSMC CoWoS: 2028 capacity roadmap and production timeline
SemiWiki USA Overview TSMC plans to double its Chip-on-Wafer-on-Substrate (CoWoS) production capacity to 260,000 300mm wafers per month by 2028, up from 130,000 at the end of 2026. This aggressive expansion addresses the surging demand f... -
Semiconductor Back-End Weekly Report September 20, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report September 20, 2026 (PDF) — Download Weekly Report September 20, 2026 (PDF) — DownloadDownload 🎙 Podcast Septe... -
Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge for Advanced 2.1D AI Semiconductor Packaging
The Elec South Korea Overview Samsung Electro-Mechanics and Qualcomm have collaborated to develop an 'organic bridge' technology for advanced 2.1D packaging in AI semiconductors. This innovation facilitates high-density, high-bandwidth i... -
Glass Substrates & TGV Technology Set to Reshape 2027 Advanced Packaging Race; US, Japan, Korea, Taiwan, China Accelerate Development
digitimes Taiwan Overview As AI chip package sizes expand, glass substrates and Through-Glass Via (TGV) technology are emerging as new focal points in advanced packaging competition. Supply chain leaders in the US, Japan, South Korea, Ta... -
AI Infrastructure Component Crunch Becomes Reality: ABF Substrate Lead Times Hit 56 Weeks, Equipment Parts Up to 40 Months
BigGo Finance Taiwan Overview The supply shortage for AI infrastructure components is becoming entrenched; TrendForce reports ABF substrate lead times surged to 48–56 weeks, approximately 4 to 4.7 times the equilibrium. HDDs reached 50 w... -
Samsung Electro-Mechanics Unveils Next-Gen Package Substrate Technologies for AI & Servers at KPCA Show 2026, Highlighting Warp Reduction & High-Density Interconnects
Samsung Electro-Mechanics South Korea Overview Samsung Electro-Mechanics showcased a comprehensive suite of next-generation semiconductor package substrate technologies targeting the AI and server markets at 'KPCA Show 2026.' The company... -
AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption
PhotonCap Unknown Overview BESI has secured over 150 cumulative orders for its hybrid bonding systems, with six integrated production lines (including 30 BESI bonders) implemented by major logic customers in partnership with Applied Mate...
