Semiconductor Back-End– category –
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Samsung HBM4: Performance and power efficiency targets for zHBM
MK (Maeil Business Newspaper) South Korea Overview Samsung Electronics is demonstrating strong confidence in supplying higher-specification HBM4 products, anticipating significant price increases next year driven by the rapid performance... -
Samsung HBM4E: Thermal management specs for 2026 AI interposers
BigGo Finance South Korea Overview As AI semiconductor interposers are projected to expand by up to 40 times, Samsung Electronics is developing Hybrid Copper Bonding (HCB) and Heat Path Block (HPB) technologies to enhance thermal managem... -
Semiconductor Back-End Weekly Report September 26, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report September 26, 2026 (PDF) — Download Weekly Report September 26, 2026 (PDF) — DownloadDownload 🎙 Podcast Septe... -
Huawei Kirin 9050 Pro: 4.3GHz clock and 2030 timeline
Invest Lingo China Overview Huawei's Kirin 9050 Pro chip shipped utilizing ultra-fine pitch hybrid bonding technology at 1.5 micrometers. This "logic folding technology" directly bonds two chips face-to-face, allowing them to function as... -
Rapidus 2nm: AI-driven custom chip manufacturing roadmap
Excite Japan Overview Japan's 2nm short Turnaround Time (TAT) semiconductor manufacturing market is being shaped by Rapidus's unique model. The Rapidus 2nm program integrates advanced Gate-All-Around (GAA) technology, single-wafer proces... -
Hybrid Bonding: Imec and EV Group 200nm demo explained
Tara Minunilor Belgium Overview Hybrid bonding, a semiconductor integration technology, directly connects dies or wafers with copper, bypassing traditional solder microbumps. Imec and EV Group demonstrated 200nm copper interconnect pitch... -
SK Hynix Hybrid Bonding: 90% yield and 3-year lifespan specs
The Economy South Korea Overview SK Hynix has stipulated stringent quality requirements for adopting hybrid bonding, a core technology for next-generation HBM manufacturing. The company demands a yield rate between 90% and 98% and a prod... -
ASE Technology: AI revenue growth and 17.8B TWD fab specs
Seeking Alpha Taiwan Overview ASE Technology Holding (ASX) reported a significant acceleration in revenue and margin growth, driven by surging advanced packaging demand for AI and HPC. Q2 2026 saw a 26.7% year-on-year revenue increase, w... -
Samsung & SK Hynix HBM4: Production timeline and 80% yields
Businesskorea South Korea Overview Samsung Electronics and SK hynix are accelerating HBM production schedules due to intensified supply-demand imbalance driven by expanding AI data center investments. Samsung plans to nearly double HBM4 ... -
Synopsys A14: TSMC multi-die design and UCIe 64G specs
The Register UK Overview Synopsys has expanded its advanced node design collaboration with TSMC, enhancing support for A14 design flows, AI-driven automation, and multi-die systems using CoWoS and Co-packaged optics. Key N2P milestones i...
