Semiconductor Back-End– category –
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Samsung’s zHBM Concept Promises 70% Lower I/O Power, 2.3x Bandwidth vs. HBM5 via Hybrid Bonding for Edge AI
Tom's Hardware South Korea Overview Samsung proposes zHBM, an innovative memory architecture that directly stacks DRAM onto the processor, bypassing the interposer, and is projected to reduce I/O power by approximately 70% compared to HB... -
ASE’s SPIL Nears Arizona Back-End Test Facility Expansion Amidst $10.5B CAPEX Surge; Amkor Boosts US Packaging Investment to $12B
TrendForce Taiwan Overview ASE subsidiary SPIL is finalizing plans for a new back-end test facility in Arizona, part of ASE's $10.5 billion CAPEX for 2026, which includes $4 billion for new facilities and $6.5 billion for equipment. Conc... -
CSIS Report: AI and HBM Demand Drive New Semiconductor Shortage, Highlighting Structural Shift and Supply Chain Security Concerns
CSIS USA Overview A CSIS report indicates that the current memory shortage reflects both structural demand growth from AI and cyclical market fluctuations. The rapid expansion of AI data centers has led to a surge in demand for HBM (High... -
Google Reportedly Considering CoWoS as Backup for 2027 TPUs Amid Intel EMIB-T Substrate Yield Lag Reports
No source name USA Overview Google's Humufish TPU project, slated for mass production by late 2027, is reportedly considering TSMC's CoWoS as a backup packaging solution, following reports of lagging substrate yields for Intel's EMIB-T t... -
Nvidia Chip Sales Projected to Double Next Year, Accelerating HBM4 Transition Amid TSMC CoWoS Packaging Bottleneck
No source name USA Overview Nvidia CEO Jensen Huang forecasts a doubling of Nvidia chip sales next year and an accelerated transition to HBM4, with TSMC's CoWoS advanced packaging identified as a primary shipping bottleneck. CoWoS is cru... -
FCS Group Secures Exclusive Taiwan/Southeast Asia Distribution Rights for CKST Glass Substrate Equipment, Entering AI Advanced Packaging Market
BigGo Finance Taiwan Overview FCS Group, an injection molding machine manufacturer, has secured exclusive distribution rights for CKST (China Korea Smart Technology) glass substrate advanced packaging equipment in Taiwan and Southeast As... -
Samsung Electronics Reorganizes Cheonan Plant for HBM Packaging, Outsourcing Mobile AP Backend Processes to Boost AI Memory Capacity
TrendForce South Korea Overview Samsung Electronics is reportedly reorganizing its Cheonan plant's backend operations to prioritize High Bandwidth Memory (HBM) packaging due to surging AI demand. This strategic shift involves phasing out... -
HBM Identified as Primary Bottleneck for AI Chip Manufacturing; Nvidia, Google, AMD, Amazon Consumed 90% of Global Supply in 2025
New Market Pitch USA Overview High Bandwidth Memory (HBM) has emerged as the most significant bottleneck in AI chip manufacturing, surpassing advanced packaging technologies like CoWoS. According to Epoch AI estimates, just four companie... -
TSMC to Boost 2nm and 3nm Advanced Process Capacity by up to 22% by Mid-2027 to Meet Soaring AI/HPC Demand
BigGo Finance Taiwan Overview TSMC plans a significant capacity expansion for its 2nm and 3nm advanced processes to meet surging demand for AI and HPC chips. The 2nm monthly capacity is projected to increase by approximately 22% to 110,0... -
TSMC to Double CoWoS Advanced Packaging Capacity to 260,000 Wafers/Month by 2028, Driving OSAT and Intel Orders Amid Supply Crunch
BigGo Finance Taiwan Overview TSMC plans to double its CoWoS advanced packaging capacity from 130,000 wafers/month to 260,000 wafers/month by the end of 2028, primarily driven by surging AI chip demand. This expansion, centered on its AP...
