Semiconductor Back-End– category –
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Applied Materials Reports $9.12 Billion in Q3 2026 Revenue, Plans to Double Semiconductor Systems Output by 2028 Amid Surging Demand
GlobeNewswire USA Overview Applied Materials announced Q3 2026 revenue of $9.12 billion, marking a 25% year-over-year increase and slightly exceeding market expectations. The company maintains strong leadership and a pipeline of innovati... -
KLA Forecasts $1.1 Billion in Advanced Packaging Revenue for 2026, Driven by Surging AI and HBM Demand
Quartz USA Overview KLA Corporation anticipates its advanced packaging business revenue will reach approximately $1.1 billion in 2026, representing over 70% year-over-year growth, fueled by increasing AI infrastructure investments and se... -
Ibiden Commits ¥500 Billion to ABF Substrates for AI Servers, Anticipating Supply Crunch Beyond 2028
MK Japan Overview Ibiden, the world's leading AI substrate manufacturer, announced a ¥500 billion investment from this year to 2028 to expand production capacity for IC package substrates for AI and high-performance servers. Despite long... -
AI Demand Strains CoWoS and SoIC Supply: Global Demand to Double to Over 2.5M Wafers by 2027, Facing 10-20% Shortfall
Exponential Industry USA Overview TSMC's CoWoS and SoIC advanced packaging technologies are now the primary physical constraints for AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wafer... -
NVIDIA Accelerates Feynman AI Platform; TSMC Ramps SoIC Capacity to 50K Wafers/Month by 2027
Benzinga Taiwan Overview NVIDIA is expediting the roadmap for its next-generation Feynman AI platform, prompting TSMC to significantly boost its advanced packaging capabilities. TSMC is rapidly expanding its SoIC technology production, a... -
TSMC Achieves Over 98% CoWoS Yield; ABF Substrates Emerge as Next Bottleneck for AI Chip Expansion
Xenospectrum Taiwan Overview TSMC has announced that its advanced CoWoS packaging technology, particularly for 5.5x reticle AI chip products, consistently achieves yields exceeding 98%. While CoWoS capacity has doubled annually for three... -
Semiconductor Back-End Weekly Report August 9, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 09, 2026 (PDF) — Download Weekly Report August 09, 2026 (PDF) — DownloadDownload 🎙 Podcast August 09, ... -
TSMC CoWoS Advanced Packaging Becomes Critical Bottleneck in AI Chip Supply, Sold Out Through 2026
Tech Times USA Overview The bottleneck in AI chip production has shifted from silicon manufacturing to advanced packaging, specifically TSMC's CoWoS technology, with capacity fully booked until the end of 2026. A severe shortage of ABF s... -
Silicon Box Ships Over 500 Million Chiplet Packages from Singapore, Scaling Manufacturing Output
Digital Journal (PR-Zen) Singapore Overview Singapore-based advanced packaging company Silicon Box announced it has shipped over 500 million chiplet packages. This marks a significant milestone demonstrating the company's manufacturing c... -
Supercomputing News Emphasizes Critical Role of Advanced Packaging (CoWoS, EMIB, T-AI) in AI Accelerators
Supercomputing News Global Overview Supercomputing News published an analytical article emphasizing the critical role of advanced packaging technologies like CoWoS, EMIB, and T-AI in enhancing AI accelerator performance. These technologi...
