Semiconductor Back-End– category –
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Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
Intel’s EMIB-T Emerges as CoWoS Alternative, New XBM Memory Architecture to Alleviate AI Memory Bottleneck
Tom's Hardware USA Overview Intel's 2.5D packaging technology, EMIB-T, is emerging as a credible alternative to TSMC's CoWoS for large-package AI accelerators, expanding validation for 36/35 µm bump pitch to 4.5x reticle silicon packages... -
Samsung and SK hynix Reportedly Reconsidering Hybrid Bonding Timeline for HBM, 16-High HBM4E May Be Earliest Adoption
TrendForce Taiwan Overview Samsung Electronics and SK hynix are reportedly reassessing the timeline for the widespread adoption of hybrid bonding technology in High-Bandwidth Memory (HBM). While initial expectations pointed to HBM4, both... -
Korea Institute of Industrial Technology Develops Novel Chip Integration Process Achieving 4x Commercial HBM Density
EurekAlert! South Korea Overview Researchers at the Korea Institute of Industrial Technology (KITECH) have developed an innovative chip integration process that achieves approximately four times the integration density of commercial High... -
Micron Invests $9.3 Billion in Hiroshima for HBM Production Launching 2028, Expands Packaging Capacity in Singapore
TechsCurrent Japan Overview Micron Technology has broken ground on a $9.3 billion expansion of its Hiroshima, Japan factory to bolster High-Bandwidth Memory (HBM) production, with shipments expected around summer 2028, supported by Japan... -
AT&S Transforms Austrian Fehring Plant into Innovation Hub with €10M Investment, Bolstering Advanced PCB & Thermal Solutions
AT&S (Press Release) Austria Overview AT&S, a global leader in high-end PCBs and IC substrates, is investing approximately €10 million in its Fehring plant in Austria. This strategic upgrade aims to establish the facility as an innov... -
AI Memory Shortage Sparks Advanced Packaging Crisis: Ultrafast Lasers and Glass Substrates Emerge as New Bottlenecks
Chanelink China Overview A 'capacity crisis' in advanced packaging processes, triggered by the AI memory shortage, is causing ultrafast laser suppliers to become a new bottleneck in the supply chain. AI accelerators demand highly advance... -
HBM and ABF Shortages Intensify AI Chip Supply Bottlenecks, Ajinomoto Forecasts Over 20% ABF Supply Gap by 2027
Semiconductor Engineering USA Overview The primary bottlenecks for AI chip production are the critical shortage of High-Bandwidth Memory (HBM) and the complex packaging capacity required for GPUs/XPUs by Nvidia, AMD, and Google, coupled ... -
TSMC Significantly Expands CoWoS Advanced Packaging Capacity, to Begin Production of 14-Reticle-Size Packages by 2028 for Surging AI Demand
Biya Global Limited Taiwan Overview TSMC is substantially expanding its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity to meet the surging demand for AI chips. The company aims to nearly quadruple CoWoS capacity to 130,00... -
AT&S Initiates High-Volume AI Substrate Production in Malaysia, Backed by Major Customer Commitments and Projecting Substantial Revenue Growth
boerse-social.com Austria Overview AT&S, a leading Austrian manufacturer of high-end IC substrates, has commenced high-volume production of advanced AI substrates at its new Kulim, Malaysia, facility. This expansion, supported by lon...
