Background and Demands of the Power Semiconductor Market
Sectors such as Electric Vehicles (EVs), Hybrid Electric Vehicles (HEVs), renewable energy systems, and industrial infrastructure are undergoing rapid advancements in efficiency and miniaturization, elevating the importance of power semiconductors. Next-generation power semiconductors, particularly Silicon Carbide (SiC) and Gallium Nitride (GaN) devices, offer superior characteristics like high breakdown voltage, low power loss, and high-speed switching compared to conventional silicon (Si) devices, leading to their increasing adoption in these applications. However, high-power-density operation generates significant heat within these devices, making efficient thermal management and high-performance die-attach materials indispensable. Furthermore, considerations for sustainability within the precious metal materials supply chain represent a new industry challenge.
Key Developments and TANAKA’s Technologies
TANAKA Precious Metals Group has announced its intention to prominently feature advanced die-attach materials designed to enhance the performance and reliability of next-generation power semiconductors, alongside its circular economy initiatives, at SEMICON Southeast Asia 2026. The main exhibits will include:
- Silver Sintering Pastes: TANAKA will showcase silver sintering pastes specifically engineered as conductive die-attach materials for wide-bandgap semiconductors like SiC and GaN. These pastes achieve exceptionally high thermal conductivity, exceeding 200 W/m·K, coupled with superior reliability in high-temperature environments. Their robust resistance to thermomechanical stress during power cycling contributes significantly to extended device lifetimes.
- AgSn TLP Sheets: Also featured will be AgSn (Silver-Tin) Transient Liquid Phase Sintering (TLPS) sheets capable of accommodating large chip sizes up to 20mm. These sheets are designed for high-power applications in EVs, HEVs, and industrial infrastructure, where high currents flow, providing bond strengths of over 50 MPa and ensuring long-term reliability. Their sheet form factor also facilitates easier integration into manufacturing processes.
- Bonding Wires: A comprehensive range of bonding wires will be presented, including gold, silver, copper, aluminum, and palladium-coated copper. These wires are crucial for reliable electrical interconnections within semiconductor packages.
- Precious Metal Recovery and Refining Technologies: Leveraging its strength as a precious metal supplier, TANAKA will also highlight its technologies for recovering and refining precious metals from used products. This demonstrates the company’s commitment to the effective utilization of limited resources and a circular economy, contributing to a sustainable society.
Impact and Future Outlook
The die-attach materials unveiled by TANAKA Precious Metals are expected to play an indispensable role in maximizing the performance of next-generation power semiconductors, driving improvements in EV power conversion efficiency, enhancing the reliability of renewable energy systems, and bolstering industrial infrastructure. Specifically, sintering materials that combine high thermal conductivity and high reliability will broaden the application scope of SiC/GaN devices and accelerate the trend toward higher power output and miniaturization. The presentation of precious metal recovery and refining technologies also underscores the commitment of material manufacturers to actively contribute to reducing the environmental footprint and enhancing resource efficiency across the entire supply chain, marking a crucial step towards building a sustainable electronics industry. As the power semiconductor market continues its growth trajectory, demand for these advanced material technologies and circular approaches is projected to intensify.
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