SemiMedia Reports China Accelerating Global Catch-Up in Advanced Packaging Materials for AI and HPC

SemiMedia China

Overview

A SemiMedia report indicates that China is accelerating its global catch-up in advanced packaging materials, driven by the demand for AI chips and high-performance computing (HPC). The focus is on developing high-performance resins, dielectric materials, underfill, epoxy molding compounds, and thermal interface materials. Chinese companies are actively seeking breakthroughs in areas like photosensitive polyimide and CMP materials to meet the needs of chiplet and 2.5D/3D packaging technologies.

In Depth

Key Findings

According to a recent SemiMedia report, ‘Inside China’s Semiconductor Materials Catch-Up,’ China is rapidly advancing its capabilities in advanced semiconductor packaging materials, driven by the explosive demand from Artificial Intelligence (AI) chips and High-Performance Computing (HPC). The nation is particularly focusing its efforts on developing high-performance resins, dielectric materials, underfill, epoxy molding compounds (EMCs), and thermal interface materials (TIMs).

Technical / Clinical Details

Chinese companies are aggressively pursuing localization and performance enhancements in material technologies to support next-generation advanced packaging architectures such as chiplet technology and 2.5D/3D packaging. Specifically, innovations are underway in high-performance resins for thinner, denser packaging, low-dielectric constant materials for signal integrity, underfill materials to mitigate stress between die and substrate and improve reliability, EMCs for physical device protection, and TIMs for efficient thermal management. These materials are critical for addressing the high operating temperatures, power densities, and miniaturization challenges faced by AI and HPC devices. China aims for breakthroughs in key semiconductor process areas like photosensitive polyimide and Chemical Mechanical Planarization (CMP) materials, with some domestic companies already offering products that rival or even surpass international standards.

Background & Context

Advanced packaging has become a crucial strategy in the semiconductor industry to overcome the limitations of Moore’s Law. The evolution of AI and HPC, in particular, has increased chip design complexity, creating performance and reliability demands that traditional packaging technologies cannot meet. Under its national strategy for semiconductor self-sufficiency, China is intensely focused on resolving material bottlenecks. This effort aims to stabilize material supply in the global supply chain and strengthen the domestic semiconductor semiconductor ecosystem.

Strategic Significance & Outlook

China’s rapid progress in advanced packaging materials is likely to have a substantial impact on the global semiconductor supply chain. The enhancement of domestic material supply capabilities and technological levels will shift the competitive landscape in international markets, prompting multinational corporations to reconsider their collaboration and competitive strategies. Moving forward, China is expected to leverage these material advancements to drive further performance improvements and mass production of AI chips and HPC devices, playing an increasingly vital role in global technological innovation. Sustainable material development and compliance with environmental regulations will also be important directions for future R&D.