Vol. 48 | 2026.06.15 — 06.21 | Market Mood: 78 / 100 — Optimistic
AI is rapidly transforming IT & Electronics, driving 25%+ annual growth in data centers. Critical advancements in advanced semiconductor packaging (CoWoS, glass substrates) and liquid cooling are scaling AI compute, with CoWoS capacity projected to hit 140K wafers/month by 2026. Quantum computing progresses toward fault-tolerance, supported by significant investment, while optical interconnects (CPO, 1.6T modules) emerge as the new performance bottleneck for AI data centers. Western players must strategically invest in these converging technologies to secure a competitive edge and capitalize on critical market shifts.
This week’s data offers vital insights for strategic R&D and investment decisions in these dynamic landscapes.
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