Key Findings
The Advanced Semiconductor Packaging & Chiplet Show (ASPS) will be held from August 26-28, 2026, at the Suwon Convention Center in South Korea. This exhibition will focus on advanced semiconductor packaging technologies, chiplet architectures, and High Bandwidth Memory (HBM), presenting critical technology trends and business opportunities that will shape the future of the Korean semiconductor industry. Particular emphasis will be placed on the latest packaging solutions essential for enhancing the performance and efficiency of AI chips.
Technical / Clinical Details
- Advanced Semiconductor Packaging: A wide range of advanced packaging technologies will be showcased, including 2.5D/3D stacking, fan-out packaging, and Co-Packaged Optics (CPO), targeting applications such as AI, High-Performance Computing (HPC), automotive, and 5G/6G communications that demand high integration, miniaturization, and high efficiency.
- Chiplet Architectures: The latest trends in chiplet technology will be presented, demonstrating how combining multiple chiplets with different functionalities can increase design flexibility, reduce manufacturing costs, and improve overall system performance. This is a crucial approach to extend beyond the limits of Moore’s Law.
- High Bandwidth Memory (HBM): HBM technology, essential for breaking the “memory wall” in AI processors, utilizes Through-Silicon Vias (TSVs) to stack multiple DRAM dies, enabling ultra-fast data transfer with the processor. The exhibition will focus on the latest generations of HBM and their manufacturing technologies.
Background & Context
The explosive growth of AI demands unprecedented innovation in semiconductor packaging technology. South Korea, home to global memory and foundry giants like Samsung Electronics and SK Hynix, is at the forefront of advanced packaging technology development. ASPS serves as a platform for the entire Korean semiconductor ecosystem to converge and further enhance its importance in the global supply chain.
Strategic Significance & Outlook
ASPS 2026 provides an excellent opportunity for Korean semiconductor manufacturers to showcase their latest packaging technologies and solutions to the world. The exhibited technologies are expected to elevate AI chip performance to the next level and accelerate the widespread adoption of AI in various fields, including data centers, autonomous driving, and high-performance mobile devices. This event is also anticipated to contribute to the standardization of advanced packaging and chiplet technologies, strengthening the supply chain, and fostering new business collaborations, thereby supporting the sustainable growth of the entire semiconductor industry.
Source: https://www.semipkgshow.com/en
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