Key Findings
Indium Corporation’s experts at the ICEPT 2026 conference showcased a groundbreaking next-generation copper sintering paste specifically engineered for high-power semiconductor applications. This novel material delivers high reliability and superior thermal and electrical performance, critically enabling strong bonding without the need for expensive gold or silver plating. This positions it as a highly promising die-attach solution for the rapidly evolving power electronics sector.
Technical / Clinical Details
The newly developed copper sintering paste offers significant advantages over conventional die-attach materials. By eliminating the requirement for gold or silver plating on component surfaces, it substantially reduces manufacturing costs and simplifies process steps. Its exceptional thermal conductivity facilitates efficient heat dissipation from high-power semiconductor devices, which is vital for enhancing device performance and extending operational lifespan in demanding applications such as electric vehicles, renewable energy systems, and industrial motor controls. The high electrical conductivity ensures robust and stable power delivery.
Furthermore, Indium Corporation also highlighted Durafuse® LT, a bismuth-free, indium-containing lead-free solder designed for mid-temperature electronics assembly. This innovative solder significantly improves drop shock resistance and reduces electromigration rates, which are critical performance metrics for modern electronic devices. These characteristics make Durafuse® LT an ideal solution for next-generation electronics, particularly in compact and high-stress environments like mobile devices and wearables, where both miniaturization and long-term reliability are paramount.
Background & Context
The semiconductor industry is facing increasing challenges related to thermal management and reliable interconnections as devices become smaller, more powerful, and operate at higher power densities. For power electronics, high-flux heat dissipation requires advanced die-attach materials, while broader environmental regulations are driving the shift towards lead-free soldering solutions. Indium Corporation’s new copper sintering paste and Durafuse® LT directly address these industry imperatives, offering solutions that meet both performance and sustainability goals.
Strategic Significance & Outlook
These advanced bonding and interconnect materials are poised to revolutionize the performance and reliability of next-generation semiconductor devices and electronic assemblies. The copper sintering paste has the potential to become a standard die-attach material in the power electronics market, while Durafuse® LT will play a crucial role in advancing lead-free initiatives across consumer and industrial electronics. Through these innovations, Indium Corporation is contributing significantly to the realization of higher-performing, more robust, and sustainable electronic products globally.
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