Market Trends– category –
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TSMC’s CoWoS Shortage Eases, But Bottleneck Shifts to ‘Hyper-Scale Packaging’ as Google Reportedly Engages Samsung for TPU Production
Zhitong Finance APP Hong Kong Overview Reports suggest Google is in discussions with Samsung Electronics regarding the production of specific hardware components for its AI training and inference Tensor Processing Units (TPUs), highlight... -
ASE Technology Raises 2026 LEAP Revenue Outlook Above $3.5 Billion, Driven by Soaring AI Advanced Packaging Demand
Zacks USA Overview ASE Technology Holding expressed strong confidence in its Leading Edge Advanced Packaging (LEAP) business trajectory, raising its 2026 LEAP revenue outlook by 10% to over $3.5 billion. This upward revision explicitly r... -
TSMC Narrows CoWoS Supply-Demand Gap from 20% to 10% by End of 2026; NVIDIA to Adopt Next-Gen CoPoS for 2028-2029 Mass Production
Moomoo Singapore Overview TSMC is accelerating advanced packaging capacity expansion, projecting its CoWoS supply-demand gap to significantly narrow from approximately 20% to 10% by the end of 2026. Concurrently, research and development... -
AT&S Unveils €2 Billion Kulim Expansion to Fuel AI Boom with Advanced IC Substrates and PCBs
AT&S Official Press Release オーストリア Overview AT&S is undertaking a monumental €1.5 billion to €2 billion expansion of its Kulim, Malaysia, manufacturing facility. Driven by long-term commitments from industry leaders like AMD, t... -
Advanced Packaging: Glass Core Substrates Emerge as Next-Gen Frontier; Intel Commits Over $1 Billion to R&D for High-Volume Production by 2030
Infra Startups USA Overview Advanced packaging is a critical bottleneck in the AI boom, with TSMC's CoWoS capacity dictating the pace of global AI infrastructure build-out. Shipments of CoWoS wafers are projected to reach approximately 4... -
Samsung, SK Hynix Eye Honam Region in South Korea for First Advanced Packaging Fabs Amid Soaring AI Memory Demand; Amkor Plans $980M Expansion
The Elec Inc. South Korea Overview Samsung Electronics and SK Hynix are considering establishing their first advanced semiconductor packaging plants in South Korea's Honam region to meet surging AI infrastructure demand. Samsung is weigh... -
Precision Science Fuels Biopharma M&A Surge: Q1 2026 Hits $65B+, Marking Industry’s ‘Full Recovery’
BioSpace / PwC, Pharmaceutical Technology / PwC USA Overview PwC's latest report declares the biopharma ecosystem 'fully recovered,' with Q1 2026 M&A deal values exceeding $65 billion, marking the largest quarter since 2020. This rob... -
Recipharm Infuses Millions into US Sterile Fill-Finish, Bolstering Advanced Therapy Manufacturing
Recipharm (プレスリリース), Fierce Pharma スウェーデン Overview Global CDMO Recipharm is making a multi-million dollar strategic investment to significantly enhance its US sterile fill-finish capabilities, addressing the surging demand f... -
Oral GLP-1 Agonist Elecoglipron Achieves Landmark 11.8% Weight Loss and Superior Glycemic Control in Phase 2 Trial
News-Medical.Net 他 USA Overview The oral GLP-1 receptor agonist elecoglipron delivered compelling results in its Phase 2b SOLSTICE clinical trial, achieving up to 11.8% dose-dependent body weight reduction and significantly improving gl... -
Novo Nordisk’s Oral Wegovy Approved in UK, Becoming Europe’s First Oral GLP-1 Obesity Treatment
Clinical Research News UK Overview Novo Nordisk's oral GLP-1 receptor agonist, Wegovy (semaglutide tablet), has received approval in the UK, marking its entry as the first oral obesity medication in Europe. This approval is expected to s...
