May 2026– date –
-
Sn-Coated Cu Solder Paste via Transient Liquid Phase Bonding Offers High-Reliability for Power Device Packaging
MDPI Switzerland Overview This MDPI paper reports on the potential of Sn-coated Cu solder paste for power device packaging using Transient Liquid Phase Bonding (TLPB). While Cu offers excellent electrical and thermal conductivity, its ox... -
Talc’s Multifunctional Role: Enhancing Performance in EV Batteries and Power Electronics
Alliance Chemical USA Overview Talc plays a crucial role in advanced technologies from EV batteries to power electronics. Talc-filled silicone or polyurethane gap pads serve as thermal interface materials in EV battery modules, providing... -
Henkel Delivers Comprehensive Adhesion & Sealing Solutions for Advancing E-Mobility Battery Systems
Henkel Adhesives Germany Overview Henkel offers a comprehensive suite of solutions for e-mobility, including adhesives, thermal adhesives, and safety potting compounds for EV battery systems. These materials are engineered to enable cost... -
Nora Systems’ noraplan® nTx Rubber Flooring Halves Installation Time with Integrated Self-Adhesive Technology
Continental Flooring Company USA Overview Nora Systems, Inc. has launched noraplan® nTx, a revolutionary sheet rubber flooring that cuts installation time by up to 50%. This next-generation product features a pre-applied, solvent-free se... -
Arctic Unveils TP-4 Premium Thermal Pads: Setting New Standards for Electronic Component Cooling
TechPowerUp Switzerland Overview Arctic has launched the TP-4 series, a new line of high-performance thermal pads engineered for efficient heat transfer and robust component protection across diverse electronic hardware. Designed for RAM... -
Novel Silicone-Free Hybrid TIM Achieves Stable Low Thermal Resistance Under Harsh Conditions for Power Modules
PatSnap Eureka USA Overview Research from PatSnap Eureka reports on a novel thermal interface material (TIM) optimized for power modules operating under harsh temperature and humidity. The proposed material, a silicone-free epoxy-polysil... -
Resonac Advances Niobium Anode Development for Grid-Scale Energy Storage Systems
PatSnap Eureka Japan Overview Resonac Holdings is pushing forward with the development of advanced niobium-based anode materials for grid-scale energy storage systems. The company's semiconductor and electronic materials division focuses... -
Yousan New Materials Unveils High-Performance Non-Silicone Thermal Interface Pads for AI Chips and Servers
Yousan New Materials China Overview Yousan New Materials has launched a new line of non-silicone thermal interface pads with thermal conductivities ranging from 2.0 to 10.0 W/m·K, specifically engineered for AI chips, servers, and high-p... -
Henkel Launches Low-Carbon Tinplate Packaging for Adhesives, Driving Sustainable Supply Chains
Packaging World Insights Germany Overview Henkel has introduced new low-carbon tinplate packaging for its adhesive products, aiming to significantly reduce CO2 emissions across its supply chain. This initiative aligns with the company's ... -
Forza Unveils HyPer Polymer™ SMP Adhesive for Low-VOC Industrial Bonding, Advancing Sustainability and Performance
SpecialChem France Overview Forza has launched HyPer Polymer™, a novel silyl-modified polymer (SMP) adhesive designed for industrial bonding applications, offering a sustainable alternative to traditional polyurethane and silicone system...
