Key Findings
Henkel significantly advances semiconductor packaging through its innovative encapsulation material solutions for Liquid Compression Molding (LCM) technology. These LCM materials enable integrated circuits (ICs) to be molded directly on wafers or panels before subsequent processing. This technology is positioned as a primary enabler for sophisticated package designs, including fan-in and fan-out wafer-level packaging (WLP), panel-level packaging (PLP), and high-bandwidth memory (HBM), all of which are critical for future high-performance computing.
Technical Details
Liquid Compression Molding involves dispensing a low-viscosity resin onto chips on a wafer or panel, followed by compression and curing. This technology offers several key advantages:
- Wafer/Panel-Level IC Encapsulation: Enables the encapsulation of multiple chips simultaneously, significantly boosting production efficiency.
- Gap Filling: Achieves uniform filling even in fine gaps and irregularly shaped spaces, preventing void formation and enhancing reliability.
- Overmolding of Stacked Memory Chips: Effectively protects individual chips and manages thermal dissipation between layers in vertically stacked structures, such as those found in HBM.
Henkel’s LCM materials are formulated with excellent flow properties, low coefficients of thermal expansion (CTE), and high thermal conductivity. These properties contribute to stress relief during thermal cycling and enhance heat dissipation performance, thereby ensuring long-term reliability and stable performance of devices.
Background & Context
The semiconductor industry is witnessing the limitations of traditional packaging technologies as demands for device miniaturization, enhanced performance, and lower power consumption escalate. Wafer-level packaging (WLP) and panel-level packaging (PLP) are foundational for advanced packaging techniques like flip-chip and System-in-Package (SiP), becoming indispensable for mobile devices and AI chips that require increased I/O density and smaller form factors. LCM technology is gaining prominence as a crucial process to reduce manufacturing costs and improve yields for these high-density, high-performance packages. Henkel is at the forefront of driving innovation in this technology from a material science perspective.
Strategic Significance & Outlook
Henkel’s liquid compression molding solutions are expected to further accelerate the adoption of advanced semiconductor packaging technologies. LCM is anticipated to become an indispensable technology, particularly in the manufacturing of high-bandwidth memory (HBM) modules, for which demand is soaring in AI and high-performance computing (HPC) sectors. The evolution of this technology will contribute to reducing packaging costs, improving productivity, and optimizing the electrical and thermal performance of devices, addressing key challenges faced by next-generation electronic devices. Henkel will continue to lead the semiconductor industry’s future through ongoing development and optimization of LCM materials in collaboration with its customers.
Get our weekly technology intelligence — free
Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.
Subscribe Free — Weekly Tech Intelligence
By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.
- Your email and selected fields are used only to deliver the newsletter.
- We never share your information with third parties.
- You can unsubscribe anytime via the link in each email.
See our Privacy Policy for details.
Takes about a minute · Unsubscribe anytime
Comments