June 2026– date –
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Malaysia Commits RM185M to Advanced Packaging Consortium, Targeting High-Value AI and HPC Semiconductors
不明 Malaysia Overview Malaysia has initiated the "Malaysia Advanced Packaging Consortium (MAPC)" with a substantial RM185 million (~$39.5M USD) investment, aiming to strategically pivot its semiconductor industry towards higher-value ac... -
Nokia Ramps Up U.S. Advanced Chip Packaging Capacity Tenfold in Pennsylvania to Fuel AI Networks
Cyprus Shipping News キプロス Overview Nokia is significantly expanding its U.S. advanced semiconductor test and packaging operations in Allentown, Pennsylvania, targeting a tenfold increase in domestic production capacity for optical ne... -
AI Infrastructure Demand Intensifies Memory Shortage: TSMC CoWoS Constraints and Vietnam Labor Shortages Create Compound Challenges
Sourceability USA Overview Rising AI infrastructure demand is generating new challenges across the semiconductor supply chain, notably a worsening memory shortage. TSMC's CoWoS packaging limitations are expected to persist with the AI bo... -
TSMC and Amkor Sign 10-Year Advanced Packaging Deal in Arizona, Amkor to Invest $7B for CoWoS Supply Boost and US Ecosystem Build-out
Bignewsnetwork India Overview TSMC and Amkor have signed a 10-year strategic agreement to expand semiconductor packaging capabilities in Arizona, USA. This partnership focuses on cutting-edge packaging technologies, including TSMC's InFO... -
imec Unleashes High-Density MIMCAP RF Interposer for D-Band Millimeter-Wave and Sub-THz Communications, Accelerating III-V Chiplet Integration
imec ベルギー Overview imec has unveiled a high-density MIMCAP RF interposer specifically engineered for demanding D-band and sub-THz wireless front-ends, alongside hundreds of gigahertz data center links. This innovative platform priori... -
TSMC’s CoWoS Shortage Eases, But Bottleneck Shifts to ‘Hyper-Scale Packaging’ as Google Reportedly Engages Samsung for TPU Production
Zhitong Finance APP Hong Kong Overview Reports suggest Google is in discussions with Samsung Electronics regarding the production of specific hardware components for its AI training and inference Tensor Processing Units (TPUs), highlight... -
Park Systems and imec Forge Alliance for Next-Gen 3D Packaging and Logic Metrology
imec Official Press Release ベルギー Overview Nano-metrology leader Park Systems has launched a two-year Joint Development Program (JDP) with imec, a global semiconductor research powerhouse. The partnership focuses on creating cutting-e... -
ASE Technology Raises 2026 LEAP Revenue Outlook Above $3.5 Billion, Driven by Soaring AI Advanced Packaging Demand
Zacks USA Overview ASE Technology Holding expressed strong confidence in its Leading Edge Advanced Packaging (LEAP) business trajectory, raising its 2026 LEAP revenue outlook by 10% to over $3.5 billion. This upward revision explicitly r... -
Glass Core Substrates Emerge as Next-Gen AI/HPC Packaging Technology, Face Commercialization Hurdles in Brittleness and TGV Formation
Pandaily China Overview Glass core substrates are garnering significant attention in the semiconductor packaging industry, driven by escalating performance demands in AI chips, HPC, and advanced processor packaging. They offer superior d... -
Henkel Expands Electronics Materials Investment in Korea, Bolstering HBM Packaging Material Development for Surging AI Semiconductor Demand
The Elec Inc. South Korea Overview German materials giant Henkel is expanding its investment in the electronics materials business in South Korea to meet the escalating demand for AI semiconductors. This includes reinforcing R&D pers...
