Vol. 49 | 2026.06.29 — 07.05 | Market Mood: 85 / 100 — Optimistic
AI Infrastructure Acceleration is reshaping IT & Electronics. Investments and breakthroughs are rapidly scaling AI compute, packaging, and data transfer. Key highlights:
- Advanced packaging (HBM, CoWoS) faces 20%+ price hikes amid shortages, driving billions in investment (HBM4 forecast: $10B).
- AI/ML funding hit $510B (H1 2026) alongside rapid agentic AI deployment.
- Quantum computing nears viability, backed by $2B US CHIPS Act funds for foundries and a 2030 PQC mandate.
- Photonics and optical interconnects boost data center efficiency, cutting power by up to 50%.
This data is vital for strategic R&D and investment decisions in the accelerating AI landscape.
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