Besi Achieves Record €292.9M Orders in Q2 2026, Driven by AI Demand and 128.8% Growth in Hybrid Bonding Technology

August 2, 2026

ET Electronics News Netherlands

Overview

BE Semiconductor Industries (Besi) reported record Q2 2026 orders of €292.9 million, a 128.8% increase year-over-year, primarily fueled by robust AI-related demand and the surging adoption of its hybrid bonding technology. Net profit reached €89 million on €249.9 million in revenue, while its hybrid bonding customer base expanded from 15 to 21 companies. This strong performance underscores Besi’s critical role in enabling advanced semiconductor packaging solutions for high-performance computing and AI applications.

In Depth

Key Findings

Dutch semiconductor equipment manufacturer BE Semiconductor Industries (Besi) achieved a record €292.9 million in orders during the second quarter of 2026, representing a remarkable 128.8% increase year-over-year. This unprecedented growth was predominantly driven by the escalating demand for artificial intelligence (AI) related applications and the accelerating adoption of Besi’s advanced hybrid bonding technology.

Technical and Business Details

Besi’s success is largely attributed to its pioneering work in hybrid bonding, a crucial next-generation semiconductor packaging technique. The number of customers utilizing Besi’s hybrid bonding solutions grew significantly from 15 to 21 within a year, indicating broad industry acceptance. Hybrid bonding offers superior density, performance, and power efficiency compared to traditional wire or flip-chip bonding by directly joining individual dies. This makes it ideal for diverse applications, including high-performance logic, advanced memory (such as HBM), co-packaged optics (CPO), and consumer electronics. For Q2 2026, the company reported a revenue of €249.9 million and a net profit of €89 million, demonstrating year-over-year increases of 32.0% and 58.0%, respectively.

Background and Industry Context

The semiconductor industry is experiencing a transformative period, largely propelled by the exponential expansion of AI, data centers, and high-performance computing (HPC). These segments demand increasingly integrated, power-efficient, and high-bandwidth chip solutions, making advanced packaging technologies like hybrid bonding indispensable. Besi’s technology is a key enabler for achieving the necessary levels of integration and performance for complex chiplet architectures and advanced HBM stacks, which are at the heart of modern AI accelerators.

Strategic Significance and Outlook

Besi plans to continue its aggressive research and development investments in hybrid bonding to further expand its customer base and market penetration. As the AI market continues its rapid ascent, Besi’s technologies are poised to play a pivotal role in enhancing semiconductor performance and cost-efficiency, thereby accelerating innovation across the industry. The company’s robust order book and technological leadership position it for sustained growth in the foreseeable future, solidifying its status as a critical enabler of the AI revolution.

Source: https://electronics.economictimes.indiatimes.com/news/semiconductors/besi-reports-record-orders-driven-by-ai-and-hybrid-bonding-technology/132575561

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