Dymax Introduces Rapid-Cure Adhesive to Boost Reliability and Throughput in Advanced AI Hardware Manufacturing

August 2, 2026

Dymax USA

Overview

Dymax has launched its innovative 9310 adhesive, specifically engineered for reinforcing fine-pitch, leadless components on printed circuit boards (PCBs). This adhesive cures remarkably fast in mere seconds with light, providing a rapid and efficient alternative to traditional underfills for advanced electronics and AI hardware. This significantly enhances manufacturing throughput and improves component reliability, crucial for next-generation computing.

In Depth

Background

The relentless advancement of cutting-edge technologies such as artificial intelligence (AI), 5G, and the Internet of Things (IoT) has driven unprecedented miniaturization, densification, and performance demands in electronic components. This trend necessitates increasingly precise and delicate component mounting on printed circuit boards (PCBs), creating substantial challenges for long-term reliability. Crucially, in high-performance AI hardware like GPUs and NPUs, where heat generation is intense and physical stresses are considerable, robust reinforcement of interconnects is absolutely indispensable. Historically, ensuring this level of reliability through conventional manufacturing processes often created significant bottlenecks for production efficiency, fueling an urgent demand for innovative solutions.

Key Findings

Dymax has unveiled its groundbreaking 9310 adhesive, meticulously engineered to bolster the reliability of fine-pitch, leadless components on printed circuit boards (PCBs). This innovative material boasts an incredibly rapid cure time of mere seconds under light exposure, establishing it as a highly efficient and superior alternative to conventional underfill methods, particularly critical for advanced electronics and AI hardware manufacturing. This technological leap dramatically enhances manufacturing throughput, leading to substantial cost reductions and elevated product reliability.

Ultra-Fast Curing for Unprecedented Efficiency: The hallmark of Dymax 9310 is its ability to fully cure in seconds upon exposure to ultraviolet (UV) or visible light. This revolutionary speed starkly contrasts with traditional thermal-cure underfills, which demand minutes to hours, drastically compressing manufacturing line cycle times and skyrocketing overall production efficiency.
Optimized for Fine-Pitch, Leadless Components: Modern electronics, especially high-performance processors and AI chips, rely heavily on extremely closely spaced (fine-pitch) and leadless components. The 9310 adhesive provides robust reinforcement for these vulnerable joints, effectively shielding them from shock and vibration damage and thereby ensuring long-term product integrity.
Advanced Underfill Alternative: While conventional underfilling involves a multi-step process of liquid resin dispensing and subsequent thermal curing, Dymax 9310’s light-curable nature streamlines the application and curing process. This promises simpler manufacturing workflows, reduced processing steps, and improved production yields.
Superior Material Properties for Enhanced Reliability: The adhesive exhibits critical properties essential for high-density electronic assemblies, including exceptional bond strength, high thermal resistance, and a low coefficient of thermal expansion (CTE). These attributes are vital for mitigating thermal stress, preventing solder joint fatigue, and ensuring robust performance across varying operational temperatures.

The introduction of Dymax 9310 adhesive is poised to catalyze a significant paradigm shift within the electronics manufacturing sector. By concurrently delivering ultra-fast curing and superior reliability, it offers the potential to dramatically improve both the production efficiency and enduring quality of devices incorporating cutting-edge technologies, from AI servers and high-performance mobile devices to autonomous driving systems and sophisticated medical equipment. This strategic innovation solidifies Dymax’s position as a pivotal supplier in the advanced electronics market, destined to play a crucial role in empowering future technological breakthroughs and driving industry progression.

Source: https://www.bignewsnetwork.com/news/279217305/dymax-launches-9310-adhesive-for-high-reliability-pcb-reinforcement

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