Haktak Enhances Semiconductor Packaging Solutions for EV Batteries, Power Electronics, and AI Servers

August 17, 2026

Haktak Global

Overview

Haktak is reinforcing its comprehensive range of semiconductor and electronics assembly materials, crucial for the reliability of high-performance devices like EV batteries, power electronics, and AI servers. The company emphasizes the critical role of underfill adhesives, coatings, encapsulants, and thermal management materials in strengthening solder joints and redistributing stress beneath BGA, CSP, and flip-chip packages. Their portfolio includes advanced single-component, post-curing, and silicone-free thermal gels, as well as low thermal resistance greases and phase change thermal interface materials, all vital for ensuring long-term operational stability in demanding electronic applications.

In Depth

Key Findings

Haktak is providing a comprehensive suite of semiconductor and electronics assembly materials designed to enhance the reliability of advanced electronic devices, including EV batteries, power electronics, and AI servers. A core focus is on underfill adhesives, which reinforce solder joints and redistribute stress beneath BGA, CSP, and flip-chip packages, mitigating the impact of thermal expansion mismatches. The selection of appropriate underfill, coating, bonding, encapsulation, and thermal materials is paramount for ensuring the long-term operational stability of these high-performance devices in challenging environments.

Technical / Clinical Details

Haktak’s product line includes specialized materials such as single-component thermal gels, post-curing thermal gels, silicone-free thermal gels, thermal greases, low thermal resistance greases, and phase change thermal interface materials (TIMs). Each material is formulated to meet specific application demands, offering tailored thermal management and mechanical protection. For instance, underfills are critical for shielding solder joints from thermal cycling, vibration, and moisture, significantly extending the lifespan of interconnects. The silicone-free thermal gels address specific application constraints where silicone contamination must be avoided, ensuring broader compatibility and performance.

Background & Context

The relentless drive towards miniaturization, higher integration density, and enhanced performance in modern electronics has led to a significant increase in heat generation, making thermal management a critical engineering challenge. Industries such as electric vehicles, AI accelerators, and data centers demand highly efficient heat dissipation and robust reliability under extreme operating conditions. Adhesives and encapsulation materials in semiconductor packaging play a pivotal role in addressing these challenges, directly influencing device performance, longevity, and overall system cost. Proper material selection is thus a key differentiator in product quality and market competitiveness.

Strategic Significance & Outlook

Haktak’s advanced material solutions provide an essential foundation for the evolution of next-generation electronic devices. The escalating demand for efficient cooling in high-performance processors for AI, coupled with the stringent reliability requirements for Battery Management Systems (BMS) in EVs, will further drive innovation in this sector. Haktak’s diverse portfolio is well-positioned to meet these growing market needs, supporting the trend towards smaller, more powerful, and more reliable electronic components. Their contributions are vital for enabling technological advancements that underpin sustainable societal progress.

Source: https://haktak.com/semiconductor-electronics-assembly/

Get our weekly technology intelligence — free

Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.

Subscribe Free — Weekly Tech Intelligence

By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.