August 2026– date –
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TSMC and Kinsus Jointly Developing New AI Chip Packaging Technology Akin to Intel’s EMIB to Address CoWoS Capacity Constraints
Tech in Asia Singapore Overview TSMC is reportedly collaborating with Kinsus to develop a novel AI chip packaging technology, resembling Intel's Embedded Multi-die Interconnect Bridge (EMIB), to alleviate the tight supply of CoWoS capaci... -
NVIDIA to Unleash ‘Rubin’ AI Platform in 2026, Integrating Next-Gen GPU, CPU, and Networking Technologies
The Daily Star Bangladesh Overview NVIDIA has announced the 2026 release of 'Rubin,' its next-generation AI chip platform, designed to dramatically elevate AI performance through tightly integrated, advanced GPUs, CPUs, and networking ch... -
EU AI Act Refines ‘Safety Component’ Definition, Narrows High-Risk Classification, and Establishes Legal Exemption for Special Category Data Processing in Bias Detection
Lumenova AI USA Overview The 2026 amendments to the EU AI Act clarify the definition of 'safety components' and exclude AI tools solely focused on administrative efficiency or performance optimization from high-risk classification. Compl...
