2026– date –
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Novel Silicone-Free Hybrid TIM Achieves Stable Low Thermal Resistance Under Harsh Conditions for Power Modules
PatSnap Eureka USA Overview Research from PatSnap Eureka reports on a novel thermal interface material (TIM) optimized for power modules operating under harsh temperature and humidity. The proposed material, a silicone-free epoxy-polysil... -
Resonac Advances Niobium Anode Development for Grid-Scale Energy Storage Systems
PatSnap Eureka Japan Overview Resonac Holdings is pushing forward with the development of advanced niobium-based anode materials for grid-scale energy storage systems. The company's semiconductor and electronic materials division focuses... -
Yousan New Materials Unveils High-Performance Non-Silicone Thermal Interface Pads for AI Chips and Servers
Yousan New Materials China Overview Yousan New Materials has launched a new line of non-silicone thermal interface pads with thermal conductivities ranging from 2.0 to 10.0 W/m·K, specifically engineered for AI chips, servers, and high-p... -
Henkel Launches Low-Carbon Tinplate Packaging for Adhesives, Driving Sustainable Supply Chains
Packaging World Insights Germany Overview Henkel has introduced new low-carbon tinplate packaging for its adhesive products, aiming to significantly reduce CO2 emissions across its supply chain. This initiative aligns with the company's ... -
Forza Unveils HyPer Polymer™ SMP Adhesive for Low-VOC Industrial Bonding, Advancing Sustainability and Performance
SpecialChem France Overview Forza has launched HyPer Polymer™, a novel silyl-modified polymer (SMP) adhesive designed for industrial bonding applications, offering a sustainable alternative to traditional polyurethane and silicone system... -
AGC Fluoroproducts Boost Semiconductor and Electronics Performance with High-Temp Release Films and Low-Outgassing Coatings
AGC Chemicals Americas USA Overview AGC's fluoroproducts provide advanced solutions to enhance the performance and reliability of semiconductors and electronics. Fluon® ETFE films offer superior release and cushioning properties at tempe... -
Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ... -
Glass Bubbles Revolutionize Adhesives and Sealants: Delivering Ultra-Lightweight and Enhanced Thermal Performance
Specialty Adhesives & Sealants Blog USA Overview Glass bubble materials are transforming low-density adhesives and sealants by offering exceptional lightweighting, insulation, and processing advantages. These lightweight hollow glass mic... -
Resonac Reports Strong Q1 2026 Earnings Driven by AI-Powered Semiconductor Materials
GuruFocus Japan Overview Resonac Holdings announced a strong Q1 2026, with its semiconductor and electronic materials segment achieving a 21% year-on-year revenue increase. This growth was primarily fueled by robust demand for advanced s... -
Henkel Pioneers Mid-Temperature Sealing for Anodizing, Boosting Efficiency and Sustainability
IPCM Germany Overview Henkel has launched Bonderite M ED 11204, a novel mid-temperature sealing technology for aluminum anodizing processes. This solution drastically reduces energy consumption, CO2 emissions, and water usage compared to...
