2026– date –
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NASA’s SSPICY Mission Demonstrates Innovative Multi-Jointed Robotic Arm and Propulsion Technologies, Significantly Advancing Autonomous In-Space Servicing and Manufacturing
NASA USA Overview NASA's SSPICY (Small Spacecraft Propulsion and Inspection Capability) mission successfully achieved critical technology demonstrations in a public-private partnership aimed at in-space satellite servicing and inspection... -
Serendipity Space Unveils Stratospheric ‘Alchemy’ System for Advanced Drug Crystallization
Facebook India Overview India's pioneering space-pharma startup, Serendipity Space, has successfully demonstrated its innovative "Alchemy" system for drug crystal manufacturing in the Earth's stratosphere. Leveraging microgravity, this s... -
Orbital AI Data Centers Accelerate to Solve Terrestrial Power Challenges; Google Plans 2027 Satellite Learning Mission
Space Daily USA Overview To address the escalating power consumption of AI-focused data centers (equivalent to 100,000 homes), companies like Google are accelerating strategies to deploy computing infrastructure in Earth's orbit. Orbital... -
US Advocates for Dual Approach: Domestic and Space-Based Semiconductor Manufacturing, Expecting Superior Performance from Orbital Production
RealClearDefense USA Overview A strategic recommendation calls for the U.S. to advance both domestic and space-based semiconductor manufacturing capabilities concurrently. This approach emphasizes that microgravity environments enable th... -
EPC Space Launches 15V, 25V, and 40V Rad-Hard eGaN FETs with >1 Mrad TID for Next-Gen Space Computing
Semiconductor Today USA Overview EPC Space LLC has announced the release of three new radiation-hardened eGaN power transistors (15V, 25V, 40V) designed for next-generation space computing systems. These devices offer ultra-low on-resist... -
President Trump Signs National Space Transportation Policy to Support Over 1,000 Annual Launches and Re-entries by 2030
The White House USA Overview President Trump has signed a national space transportation policy aimed at supporting over 1,000 annual space launches and re-entries by 2030. This memorandum directs NASA to facilitate commercial space trans... -
Microgravity Crystallization Poised to Revolutionize In-Space Manufacturing for High-Value Materials, Detailing Challenges and Future Directions
ACS Publications USA Overview A recent review highlights the expanding relevance of microgravity crystallization from structural research to low Earth orbit (LEO) and future in-space manufacturing (ISM) applications. This technique offer... -
Lens Technology Enters Advanced Chip Packaging with Self-Developed Through-Glass Vias (TGV) Substrates and Dedicated 30,000sqm Factory
Chinadaily.com.cn China Overview Chinese smartphone glass screen manufacturer Lens Technology has announced its entry into the advanced chip packaging market, driven by AI chips pushing traditional material limits. The company showcased ... -
Henkel Launches LOCTITE ABLESTIK CDF900 Conductive Die Attach Film with Over 8 W/m-K Thermal Conductivity for High-Power AI Packages
Henkel Germany Overview Henkel has introduced the LOCTITE ABLESTIK CDF900 series conductive die attach film to address thermal management challenges in high-power AI packages. This new product significantly boosts thermal conductivity to... -
HANMI Semiconductor Invests $91.4 Million in Largest-Ever 8th Production Facility in Incheon to Meet Soaring AI Chip Demand
Business Wire South Korea Overview HANMI Semiconductor is investing $91.4 million (approximately 130 billion KRW) to establish its largest-ever 8th production facility in Incheon, by acquiring Mercury Co., Ltd.'s factory, to proactively ...
