2026– date –
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AI Computing Drives 1.6T Optical Modules, CPO Slashes Power Consumption by Up to 68%
EqualOcean China Overview With Moore's Law slowing, horizontal scaling of AI clusters is unavoidable, pushing electrical interconnects to bandwidth, latency, and power limits. By 2026, the shift from copper to optics is a defining data c... -
AI Data Centers’ Next Bottleneck: Connectivity — Co-Packaged Optics Mass Production Becomes Urgent Priority
The Futurum Group USA Overview As AI clusters scale to tens of thousands of GPUs, the next major bottleneck is identified as the interconnectivity infrastructure, not compute power itself. Co-Packaged Optics (CPO) has rapidly transitione... -
STMicroelectronics Expands AI Data Center Silicon Photonics Market with PIC100 Chip Order from Chinese Customer
Business Korea South Korea Overview STMicroelectronics is actively expanding its silicon photonics market presence to meet growing AI data center demand. The company secured an order for its PIC100 chips from a major Chinese optical tran... -
Credo Foresees Silicon Photonics Future: Enabling High-Bandwidth, Low-Power for AI and Cloud Era
Credo USA Overview Silicon photonics is delivering transformative benefits to optics—miniaturization, cost reduction, and low power—akin to semiconductors in electronics. Its ecosystem is rapidly maturing, optimized for high-demand appli... -
Credo Champions Near-Package Optics (NPO) Evolution, Balancing Power Efficiency and Serviceability for AI Data Centers
Credo USA Overview Optical connectivity architecture in AI and data center infrastructure is evolving from pluggable to integrated, low-power models. Credo advocates Near-Package Optics (NPO) as a solution that integrates laser sources d... -
On-Chip Photonics Manufacturability Emerges as Urgent Challenge for Scaling AI Infrastructure
Semiconductor Engineering USA Overview The rapid evolution of AI infrastructure necessitates urgent integration of photonics directly onto chips. As computational units expand across racks and data centers, increasing data movement speed... -
Silicon Photonics Sector Sees Over $15B in M&A and Investments, Driven by AI Demand Boom
The OPTIM Update Unknown Overview Silicon photonics has become strategically vital for overcoming copper interconnect limitations as AI clusters expand. Between late 2025 and mid-2026, over $15 billion in M&A and major investments oc... -
QUASIMODO Project: Vilnius University and International Team Engineer Next-Gen Quantum Simulators with Multicomponent Ultracold Atoms
Vilnius University (VU) リトアニア Overview An international team, spearheaded by physicists from Vilnius University, is developing next-generation quantum simulators under the QUASIMODO project. This ambitious initiative leverages multi... -
Orbital Industries, ‘AlphaFold for Materials Science,’ Raises $50M, Bringing Total Funding to $71M
Resilience Media USA Overview Orbital Industries, a deep tech startup dubbed 'AlphaFold for materials science,' has raised an additional $50 million, bringing its total funding to $71 million. The company focuses on industrial tech hardw... -
IBM Quantum Promotes Next-Gen Quantum Algorithm Development for Complex Materials via Quantum Credits Program
IBM Quantum USA Overview IBM Quantum is actively driving advancements in quantum simulations for complex materials, especially those with many-body interactions, through its Quantum Credits program. This initiative supports researchers d...
