Semiconductor Back-End Weekly Report May 24, 2026

NCF Evolves into Essential Material for AI Chips, HBM Stacking, and Advanced Packaging, Ensuring Stable Bonding and Enhanced Reliability

Applied Materials Finds New Equipment Opportunities in PLP for AI Accelerators; KLA’s Process Control Gains Criticality for Complex AI Chips

Fraunhofer Unveils APECS Pilot Line: Accelerating Advanced Packaging and Heterogeneous Integration Under EU Chips Act

SK hynix Unveils $4 Billion Indiana HBM Plant, Bolstering U.S. Semiconductor Packaging and AI Supply Chains

TYLsemi Raises $43M Seed Funding, De-Risking Chiplet-Based Designs with Full-Stack Platform for AI Infrastructure Builders

Powertech and Broadcom Launch $400M Singapore Joint Venture to Expand FOPLP Manufacturing for AI ASICs

BESI Records All-Time High Orders with 128.8% Y-o-Y Growth Driven by AI Packaging and Hybrid Bonding Demand

NVIDIA Commits $1.5B Prepayment to Amkor for U.S. AI Chip Advanced Packaging Expansion by 2028