Taiyo Holdings and imec Achieve 700nm RDL Formation for Advanced Packaging, Accelerating AI and HPC Chip Performance

September 13, 2026

ChemAnalyst Japan

Overview

Taiyo Holdings, in collaboration with imec, announced the successful formation of 700nm Redistribution Layers (RDL) for advanced packaging using their next-generation FPIM series materials. This breakthrough is a critical step towards enabling finer pitch and higher performance for AI and High-Performance Computing (HPC) semiconductors. The achievement significantly enhances the integration density and electrical characteristics of semiconductor packages, driving the evolution of next-generation electronics.

In Depth

Key Findings

Taiyo Holdings, in a joint research effort with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has successfully achieved 700nm Redistribution Layer (RDL) formation for advanced packaging using its next-generation FPIM series semiconductor packaging materials. This achievement represents a critical technological breakthrough for the semiconductor industry, enabling the miniaturization and enhanced performance of AI chips and High-Performance Computing (HPC) processors. It significantly boosts both the electrical performance and integration density of semiconductor packages.

Technical Details

RDLs are multi-layered wiring structures that connect internal chip circuitry to external package interfaces, and their miniaturization directly correlates with overall semiconductor package performance and size reduction. The successful 700nm RDL formation realizes both fine-pitch wiring pattern fabrication—a challenge with conventional process technologies—and excellent electrical characteristics. Taiyo Holdings’ FPIM series are photosensitive polymer materials suitable for photolithography processes, featuring high resolution, low dielectric constant, and superior heat resistance. When combined with imec’s advanced process technologies, this enables the precise formation of extremely fine RDL patterns, achieving higher signal transmission speeds and lower signal loss.

Background and Industry Context

In today’s digital society, fields such as AI, 5G, and data centers demand ever-increasing processing capabilities for faster and larger volumes of data, making the pursuit of higher semiconductor chip performance relentless. Advanced packaging technology, in particular, is drawing attention as a new frontier for chip performance improvement amid discussions about the limits of Moore’s Law. RDL miniaturization is essential for advanced technologies like 2.5D/3D packaging and fan-out packaging to reduce interconnect distances between chips and enhance power efficiency and signal integrity. The collaboration between Taiyo Holdings and imec addresses these urgent industry needs.

Strategic Significance and Outlook

This 700nm RDL formation technology is expected to directly contribute to the development of next-generation AI accelerators, HPC processors, and high-performance chips for autonomous vehicles and IoT devices. Taiyo Holdings aims to leverage this achievement to further enhance the performance and market deployment of its FPIM series, strengthening its position as a key material supplier in the global semiconductor industry. This technology is poised to enable the creation of smaller, more powerful electronic products and is expected to expand its applications as a fundamental technology accelerating the evolution of the information society.

Source: https://www.chemanalyst.com/NewsAndDeals/NewsDetails/taiyo-holdings-achieves-700-nm-rdl-formation-44432

Get our weekly technology intelligence — free

Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.

Subscribe Free — Weekly Tech Intelligence

By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.