Key Findings
Sumitomo Bakelite has unveiled advanced encapsulation materials specifically developed for automotive power semiconductors, aimed at supporting the enhanced performance and reliability of Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs). This new material provides exceptional long-term stability and durability, reliably protecting semiconductor devices even under the severe high-temperature and high-humidity conditions characteristic of automotive environments. This represents a critical advancement for reducing device failure risks and improving overall efficiency and safety in EV/HEV motor control and power conversion systems.
Technical Details
- High Temperature and Humidity Resistance: Prevents degradation and adhesion loss of the encapsulant even under harsh conditions, such as over 150°C and high humidity, found in automotive engine bays or near battery systems. This extends the lifespan of semiconductor devices and ensures long-term reliability.
- Low Stress Characteristics: Minimizes stress caused by coefficient of thermal expansion (CTE) mismatch between the semiconductor chip and the encapsulant, reducing the risk of chip cracks and wire disconnections. This characteristic is particularly vital for next-generation power semiconductors like SiC (silicon carbide) and GaN (gallium nitride), which generate significant heat.
- Excellent Adhesion and Chemical Resistance: Possesses strong adhesion to various package substrate materials and is resistant to automotive fluids such as oils and coolants.
- Improved Partial Discharge Characteristics: Suppresses partial discharge in high-voltage power semiconductors and prevents dielectric breakdown, thereby enhancing device safety and reliability.
Background & Context
The automotive industry is rapidly transitioning towards electrification, with a swift shift to EVs and HEVs. Central to these electric vehicles are power semiconductors, which manage motor drive and battery functions. Power semiconductors handle high voltage and current, generating substantial heat, and are constantly exposed to severe conditions unique to automotive environments, including high temperature, high humidity, and vibration. Consequently, extremely high reliability and durability have been demanded from encapsulation materials that protect these semiconductor elements. Challenges that conventional encapsulants could not address have become apparent, making the development of new materials an urgent priority.
Strategic Significance & Outlook
Sumitomo Bakelite’s advanced encapsulation material will serve as a foundational technology to accelerate the further enhancement of performance and reliability in EVs and HEVs. This will enable automotive manufacturers to pursue greater design flexibility, enjoying benefits such as extended cruising range, shortened charging times, and reduced system weight. Particularly for the widespread adoption of Level 3 and above autonomous vehicles, extremely high reliability of electronic systems is indispensable, and this encapsulation material contributes to its realization. Moving forward, the company is expected to further strengthen its presence in the global automotive semiconductor supply chain.
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