Key Findings
Ajinomoto Fine-Techno has announced its latest technological innovations in ABF (Ajinomoto Build-up Film) to meet the demanding performance and reliability requirements in AI semiconductor packaging. This new technology, specifically designed to accommodate the increasing speed and data capacity of AI processors, enables finer wiring pattern formation and higher-density interlayer connections compared to conventional ABF films. This achieves improved signal transmission speed, reduced power consumption, and enhanced thermal management capabilities, making it an indispensable element for maximizing the performance of next-generation AI chips.
Technical Details
- Fine Wiring Technology: Through proprietary material design and process technology, the company has improved the capability to support sub-micron level fine wiring pitches. This efficiently connects the vast number of I/Os in AI processors, minimizing signal delay.
- High-Density Interlayer Connections: In build-up substrates that stack multiple wiring layers, the technology enhances the reliability of interlayer via connections, enabling high-density wiring layer configurations. This is crucial for realizing the complex circuit designs of AI semiconductors within the package.
- Low Dielectric Constant and Low Dissipation Factor: The dielectric properties of the film have been optimized to suppress signal degradation during high-frequency signal transmission. This ensures signal integrity during the high-speed operation of AI processors.
- Superior Thermal Management: With material designs featuring high thermal conductivity and structures that optimize heat dissipation paths, heat generated by AI semiconductors is efficiently dissipated out of the package. This maintains stable device operating temperatures and improves long-term reliability.
Background & Context
With the rapid development of generative AI and large language models (LLMs), AI semiconductors demand unprecedented data processing capabilities and computational speeds. The enhanced performance of these AI processors necessitates significant advancements not only in the chips themselves but also in the package substrates that house them. Specifically, fine-pitch wiring, high-density interlayer connections, suppression of signal degradation in high-speed signal transmission, and efficient thermal management are critical factors determining the performance of next-generation AI chips, making technological innovation in build-up materials like ABF film indispensable.
Strategic Significance & Outlook
Ajinomoto Fine-Techno’s latest ABF film technology is poised to dramatically improve the performance of AI semiconductor packaging and accelerate the further evolution of AI computing. Its impact is expected to be felt across all fields where AI is utilized, including high-performance servers for data centers, edge AI devices, and automotive AI for autonomous driving. The company plans to maintain its leadership in next-generation semiconductor packaging materials through continuous research and development and close collaboration with customers, contributing to the development of the digital society.
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