Henkel Unveils Low-Viscosity Technomelt PA 6370 Hot Melt Adhesive for Precision Small-Gap Protection in Electronic Assemblies

July 5, 2026

Adhesives/Sealants.org (Henkel) Germany

Overview

Henkel has introduced Technomelt PA 6370, a new polyamide-based, low-viscosity hot melt adhesive specifically developed for sealing narrow gaps and intricate electronic components. This innovative product offers superior protection while minimizing the risk of component damage during application. Its precision filling and rapid curing properties enhance the reliability and manufacturing efficiency of electronic devices.

In Depth

Key Findings

Henkel has announced the development and launch of Technomelt PA 6370, a new polyamide-based, low-viscosity hot melt adhesive designed for the precise sealing and protection of small gaps within complex electronic assemblies. This innovative product aims to meet the escalating demands for miniaturization and enhanced performance in modern electronic devices, significantly improving their reliability and durability.

Technical & Product Details

Technomelt PA 6370 is distinguished by its unique low-viscosity characteristic, allowing it to flow reliably into the tightest spaces around intricate electronic components, ensuring comprehensive encapsulation. Its polyamide base provides excellent resistance to heat, moisture, and chemicals, offering robust protection for electronic assemblies even in harsh environments. Furthermore, as a hot melt adhesive, it boasts rapid curing properties that drastically reduce manufacturing cycle times, thereby boosting production efficiency. This adhesive is ideal for high-performance applications such as smartphones, wearable devices, and automotive electronics, as it provides protection against vibration, shock, and moisture, in addition to electrical insulation.

Background & Industry Context

The continuous miniaturization and performance enhancement of electronic devices increase component packing density, placing increasingly stringent demands on protective materials. Narrow gaps, particularly around solder joints and delicate IC chips, are prone to moisture and contaminant ingress, elevating the risk of device failure. Conventional encapsulants often struggle with uniform filling in such micro-spaces or suffer from prolonged curing times, impeding productivity. Henkel’s Technomelt PA 6370 is, these challenges by achieving a superior balance of fluidity and rapid curing, offering a solution that enhances the quality and reliability of precision electronic assemblies. This enables suppliers to design smaller, more robust devices, strengthening their competitive edge in the market.

Strategic Significance & Outlook

The introduction of Technomelt PA 6370 is expected to significantly contribute to optimizing encapsulation processes in electronics manufacturing, accelerating the development of next-generation compact, high-density electronic devices. Henkel aims to solidify its position as an innovation leader in the electronic materials sector through this product. Widespread adoption is anticipated across various applications, including 5G communication equipment, autonomous driving systems, and smart IoT devices, thereby fostering the proliferation of more robust and reliable electronic products globally.

Source: https://adhesives.org/news-innovations/

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