Troy– Author –
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Marvell Acquires Celestial AI for $3 Billion to Secure CPO Core Technology, Expands Silicon Photonics Collaboration with NVIDIA
Global Semi Research USA Overview Marvell has strategically transformed into a key player in AI data center interconnect and custom chips by acquiring Celestial AI for approximately $3 billion in December 2025, gaining crucial Co-Package... -
Q.ANT Unveils Thin-Film Lithium Niobate Photonic AI Chip at ISC High Performance 2026, Advancing Energy-Efficient Analog Computing
Q.ANT Germany Overview At ISC High Performance 2026, Q.ANT presented its photonic analog processors, which utilize light instead of electricity. The company's thin-film lithium niobate (TFLN) photonic AI chip pilot line offers more energ... -
Intel Foundry Unveils Advanced Packaging Innovations for AI/HPC at ECTC 2026, Revolutionizing CPO with High-Performance Detachable Optical Connectors
Intel Foundry USA Overview Intel Foundry engineers presented advanced packaging technologies at ECTC 2026, redefining AI and HPC scalability limits. They demonstrated scaling of EMIB-T packaging and showcased innovations in Co-Packaged O... -
PsiQuantum Unveils Omega Quantum Photonic Chipset for Utility-Scale Computing, Secures $100M LOI with US Department of Commerce
PsiQuantum News USA Overview PsiQuantum announced its Omega quantum photonic chipset on May 28, 2026, purpose-built for utility-scale quantum computing. Manufactured on full-size wafers at GlobalFoundries, this chipset integrates all adv... -
Coherent Emphasizes Photonics as Key to AI Infrastructure Scaling, Achieving Low Power-Per-Bit and High Bandwidth Density Amidst Surging Demand
Coherent / Photonics Spectra USA Overview Coherent's Sanjai Parthasarathi highlights advanced laser and photonics technologies as central to the scalability, efficiency, and reliability of AI systems, driven by rapid AI growth and increa... -
Lightmatter Unveils 114Tbps Passage M1000 3D Photonic Interposer and 50Tbps Optical I/O Laser at InterConnect 2026, Joins NVIDIA NVLink Fusion Ecosystem
Lightmatter USA Overview At its InterConnect 2026 keynote, Lightmatter revealed a new category of lasers capable of delivering 50 Tbps of optical I/O and the Passage M1000 3D Photonic Interposer, offering 114 Tbps I/O, to enable a photon... -
Pandaily: Co-Packaged Optics (CPO) as the “Ultimate Goal” for Next-Gen AI Data Centers, Predicting Explosive NPO Adoption in 2026-27
Pandaily China Overview Pandaily reports that Co-Packaged Optics (CPO) is the core solution for next-generation AI data centers, addressing GPU communication bottlenecks. The article outlines a three-stage roadmap for optoelectronic inte... -
Vitex LLC Releases Comprehensive Technical Guide on Co-Packaged Optics (CPO) in 2026, Detailing Functionality and AI Data Center Applications
Vitex LLC USA Overview This article is an overview of a market research report published by Vitex LLC. Vitex LLC has released a comprehensive technical guide on Co-Packaged Optics (CPO) in 2026. The guide outlines CPO's transition from r... -
Wiwynn and Partners to Demo CPO Interconnect for Hyperscale AI Data Centers at Computex 2026, Accelerating Optical Scaling
PR Newswire USA Overview Wiwynn, in collaboration with ecosystem partners including Ayar Labs and GUC, will showcase co-packaged optics (CPO) interconnect innovations at Computex 2026. This demonstration aims to accelerate optical scalin... -
Optica Online to Host Industry Meeting in June 2026: Advanced Photonic Packaging for AI, Datacom, and Quantum Technologies
Optica Online USA Overview Optica Online will convene an industry meeting in June 2026 focusing on advanced photonic packaging to accelerate the transition of photonic systems from prototype to high-volume manufacturing for AI infrastruc...
