Market Trends– category –
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Singapore’s Exports Soar to 22-Year High in May 2026, Driven by AI Semiconductor Supply Chain Contributions from Micron’s HBM Packaging and UMC’s 22nm Production
FSMOne Singapore Overview Singapore's non-oil domestic exports (NODX) recorded their highest growth in 22 years in May 2026, primarily due to the nation's deep integration into the AI semiconductor supply chain. Micron Technology's HBM a... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive... -
Malaysia Invests RM185 Million ($40M) in Advanced Semiconductor R&D Initiative, Targeting 7% Global Packaging Market Share with HBM4 Test Chip Development
Malay Mail / Digital News Asia Malaysia Overview Malaysia's Ministry of Science, Technology and Innovation (Mosti) has launched a RM185 million (approx. $40 million USD) Research, Development, Innovation, Commercialization, and Economy (... -
Morgan Stanley: TSMC AI Revenue to Triple by 2027, CoWoS Packaging Remains Critical Bottleneck
HTX Insights (Morgan Stanleyレポート引用) International Overview A new report from Morgan Stanley forecasts TSMC's AI-related revenue to surge by 218% to $86.3 billion by 2027, up from $27.1 billion in 2026. However, this explosive growt... -
ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP... -
Otsuka’s ADHD Therapy Poised for FDA Approval Following Successful Phase 3b Clinical Trial
Fierce Biotech USA Overview Otsuka Pharmaceutical announced positive outcomes from its Phase 3b clinical trial for an Attention-Deficit/Hyperactivity Disorder (ADHD) treatment, marking a crucial step ahead of its U.S. Food and Drug Admin... -
U.S. DOE Awards $150 Million Grant to Solid-State Battery Manufacturing Consortium
U.S. Department of Energy (DOE) USA Overview The U.S. Department of Energy (DOE) has awarded a $150 million grant to a newly established consortium of universities, national laboratories, and industrial partners, aimed at accelerating do... -
U.S. Department of Energy Commits $3 Billion to Domestic Battery Manufacturing and Recycling Grants Program to Fortify North American Supply Chain
U.S. Department of Energy USA Overview The U.S. Department of Energy (DOE) is allocating $3 billion through its Battery Manufacturing and Recycling Grants Program to establish a viable domestic manufacturing and recycling capability for ...
