Market Trends– category –
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Malaysia Launches RM92 Million Government-Backed Initiative to Develop HBM4 Advanced Packaging Pilot Line, Targeting Higher Semiconductor Value Chain
Business News Malaysia Overview Malaysia is aggressively pursuing a strategy to elevate its position in the semiconductor value chain by focusing on IC design and advanced packaging. The Malaysia Advanced Packaging Consortium (MAPC), est... -
AT&S to Invest €1.5-2 Billion in Malaysian ABF Capacity, While IBIDEN Allocates ¥500 Billion for AI/HPC Substrate Expansion in Japan & Overseas
Sector Signals China Overview AT&S has agreed with AMD and another major tech firm to expand high-end IC substrate capacity for AI/HPC, planning a €1.5-2 billion investment in its Kulim, Malaysia plant, fully supported by long-term c... -
CoWoS Identified as Core Bottleneck for AI GPU Shipments, Distinct from HBM Shortage
BiyaPay Blog International Overview CoWoS (Chip-on-Wafer-on-Substrate) is an advanced packaging technology integrating GPUs, HBM, and chiplets; its limited capacity forms a critical manufacturing integration bottleneck for AI GPU shipmen... -
NVIDIA’s 2027 CoWoS Supply Forecast Raised 69% to 1.1 Million Interposers; AMD to See Over 50% Growth: KeyBanc Asia Supply Chain Checks Reveal Strong Demand
TipRanks USA Overview KeyBanc analyst John Vinh's Asia supply chain checks reveal strong, persistent demand across the semiconductor ecosystem. NVIDIA's 2027 CoWoS supply forecast for Rubin and Rubin Ultra was raised 69% to 1.1 million i... -
AI-Driven Advanced Packaging Orders Surge, Widening ABF Carrier Board Supply-Demand Gap, Benefiting Industry with Both Volume and Price Increases
AlphaWire International Overview Nomura Securities reports the semiconductor packaging substrate industry is experiencing a strong AI-driven recovery, with global packaging substrate shipments up 36% year-on-year in June 2026. This growt... -
Japan’s Rapidus Partners with IBM on 2nm Semiconductor Manufacturing to Bolster Indo-Pacific Supply Chain Resilience
Geopolitical Analysis / Think Tank International Overview Japan's Rapidus, in partnership with IBM, aims to establish 2nm advanced semiconductor manufacturing in Japan, strengthening the Indo-Pacific supply chain, including ASEAN countri... -
TSMC Achieves Record Q2 Revenue of $40.2B with 67.7% Gross Margin, CoWoS Fully Booked Through 2026, and Maps 14-Reticle Packaging
LongYield - Substack International Overview TSMC reported record Q2 2026 consolidated revenue of $40.20 billion and a gross margin of 67.7%, driven by robust AI chip demand and leading-edge nodes (7nm and below accounting for 77% of wafe... -
TSMC’s CoWoS Supply to Reach At Least 200K Wafers Monthly by 2027, Accelerating Expansion to Meet Soaring AI Demand
DigiTimes Taiwan Overview TSMC is accelerating its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity expansion to meet robust AI chip demand, with market indications suggesting monthly output will reach at least 200,000 wafe... -
Morgan Stanley Forecasts 93% CoWoS Demand Surge by 2027, Driven by AMD’s Venice CPU Shipments
KuCoin International Overview Morgan Stanley forecasts global CoWoS (Chip-on-Wafer-on-Substrate) demand to nearly double to 2.694 million wafers in 2027, a 93% increase from 1.394 million in 2026. This growth is predominantly driven by A... -
Wah Lee and Asahi Kasei Double Photoresist Capacity in Tainan to Capitalize on AI Advanced Packaging Boom and ABF Substrate Demand
BigGo Finance International Overview Wah Lee and Asahi Kasei are doubling high-resolution dry film photoresist capacity in Tainan to meet surging ABF substrate demand driven by AI, HPC, and advanced packaging. With the ABF substrate shor...
