New Technology– category –
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U.S. Senators Introduce Bipartisan ‘Semiconductor Supremacy Act’ to Include Space-Based Chip Manufacturing in CHIPS Act Tax Credits, Boosting Competitiveness Against China
Ted Budd (Senator's Official Website) USA Overview U.S. Senators Ted Budd and Michael Bennet introduced the bipartisan 'Semiconductor Supremacy Act' on June 11, clarifying that CHIPS and Science Act tax credits will encompass space-based... -
JAXA H3 Rocket Achieves Critical Return-to-Flight Success, Deploying 6 Satellites with Upgraded Engine Configuration; Next Launch Targets QZSS Satellite in August
Space.com Japan Overview The Japan Aerospace Exploration Agency (JAXA) successfully launched its H3 rocket on June 12, deploying six small satellites, including an ocean observation satellite and a space debris removal technology demonst... -
imec Breaks New Ground: III-V Chiplets on RF Silicon Interposer Achieve 100x Capacitance Density Boost and Sub-600nm Precision
OriginBrief ベルギー Overview imec has announced a significant breakthrough in heterogeneous integration, successfully integrating III-V chiplets onto a 300mm RF silicon interposer platform. This achievement delivers a 10-100x increase i... -
TSMC Accelerates CoPoS Packaging Development, Standardizing 310x310mm Panel Format; Introduces Glass Core Substrate for CoWoS Towards Late 2028 Mass Production
TrendForce Taiwan Overview TSMC is accelerating the development of its CoPoS (Chip-on-Panel-on-Substrate) packaging architecture, standardizing a 310x310mm panel format, with pilot production targeted for 2027 and mass production in late... -
SK hynix Begins Shipping Next-Gen HBM4E AI Memory Chips with 12-Layer Stack, 48GB Capacity, 16Gbps per Pin, and Over 20% Power Efficiency Boost
Bisinfotech South Korea Overview SK hynix has commenced shipments of its next-generation HBM4E AI memory chips, featuring a 12-layer stack with 48GB capacity, ultra-fast data transfer rates of up to 16Gbps per pin, and over 20% improved ... -
Intel Appoints Former SK hynix CEO Lee Seok-hee as Senior VP of Advanced Packaging to Bolster AI Systems
The Korea Herald South Korea Overview Intel has appointed Lee Seok-hee, former CEO of SK hynix and SK On, as Senior Vice President of Intel Foundry. Lee will lead advanced packaging, system integration, back-end technology development, a... -
TSMC and Amkor Forge 10-Year Strategic Partnership to Boost U.S. Advanced Packaging Capabilities
Focus Taiwan Taiwan Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to bolster advanced semiconductor packaging in the United States. Under this pact, TSMC will procure advanced packaging and test services f... -
Micron’s HBM Capacity Sold Out Through 2026, Securing Position in NVIDIA’s Next-Gen AI Platform “Vera Rubin”
Investing.com USA Overview Micron Technology has announced that its high-bandwidth memory (HBM) production capacity is completely sold out through 2026, with long-term contracts secured, reflecting overwhelming demand for AI-driven HBM. ... -
SK Hynix Begins Shipping 12-Layer Next-Gen ‘HBM4E’ Samples for AI, Delivering Significant Performance and Power Efficiency Gains Amidst NVIDIA CEO’s Endorsement
SK hynix Inc. South Korea Overview SK Hynix has commenced shipping samples of its 12-layer 'HBM4E,' a next-generation DRAM for AI, to key customers. This HBM4E features data processing speeds of up to 16Gbps per pin and over 20% improved... -
Samsung’s Advanced Packaging Lag Clouds AI Chip Comeback, Falling Behind TSMC and Intel
digitimes Taiwan Overview Despite efforts in HBM and foundry services, Samsung Electronics' lagging advanced packaging capabilities remain a significant weakness in the AI chip supply chain. Industry sources and Korean media reports indi...
