New Technology– category –
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Henkel and Hans Claussen to Showcase LOCTITE® Adhesives, Sealants, and Coatings for Demanding Marine Applications at Nor-Fishing 2026
Henkel Adhesives Germany Overview Henkel, partnered with Hans Claussen, will present its LOCTITE® adhesives, sealants, and coatings portfolio at Nor-Fishing 2026. These solutions are specifically designed to meet the rigorous and demandi... -
Siegwerk Launches Cirkit Novaseal Heat Seal Lacquer Portfolio Integrating Circular Economy Strategy for Fiber-Based and Flexible Packaging
Packaging Strategies Germany Overview Siegwerk has introduced its Cirkit Novaseal heat seal lacquer portfolio for fiber-based and flexible packaging, engineered to provide consistent sealing, hot-tack performance, and bond strength. The ... -
Fengling New Materials: Expert Manufacturer of UV-Curable Adhesives for Electronics, Medical, and Optical Industries
YouTube (Fengling New Materials) China Overview Fengling New Materials specializes in UV-curable adhesives, epoxy adhesives, and advanced bonding materials for diverse industrial applications including electronics, medical devices, optic... -
ResearchGate Paper: Semi-Interpenetrating Organogel OPSA with Reversible Hydrogen Bonding Developed for Dynamic Optical Devices
ResearchGate (Wiley - Advanced Materials Technologies) Global Overview A ResearchGate paper reports the development of semi-interpenetrating network organogel optical pressure-sensitive adhesives (OPSAs) with reversibly controlled hydrog... -
PatSnap Eureka Report: UV-Curable Adhesives Achieve Ultra-Fast Curing (2-3 seconds) for Accelerated Chip Embedding in Semiconductor Manufacturing
PatSnap Eureka Global Overview A PatSnap Eureka report reveals the semiconductor industry's increasing adoption of UV-curable adhesives for chip embedding due to their rapid curing capabilities and advantages in precision manufacturing. ... -
PatSnap Eureka Report: Reducing Voiding in Chip Embedding Epoxies Critical for High-Reliability Systems in Automotive and Aerospace
PatSnap Eureka Global Overview A PatSnap Eureka report identifies reducing voiding in chip embedding epoxies as a critical reliability challenge in high-performance electronic packaging, particularly for automotive and aerospace systems.... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
Alliance Chemical Report: Advanced Talc Applications Crucial for EV Battery Thermal Management and Power Electronics Reliability
Alliance Chemical USA Overview An Alliance Chemical report highlights that engineered talc grades are becoming critical in high-tech manufacturing, including EV battery thermal management and power electronics. In epoxy molding compounds... -
Henkel Adhesives Innovates Advanced Semiconductor Packaging Materials for High-Performance Computing and Generative AI
Henkel Adhesives Germany Overview Henkel is developing innovative material solutions for advanced semiconductor packaging, addressing demands for higher performance, greater integration, and improved efficiency in a rapidly evolving tech... -
WEVO-CHEMIE Unveils WEVOSIL 23130 High-Performance Silicone Seal for Enhanced EV Battery Thermal Runaway Protection
Indian Chemical News Germany Overview WEVO-CHEMIE has introduced WEVOSIL 23130 liquid silicone rubber, a high-performance silicone seal designed for thermal runaway protection in EV battery packs. This filler-free LSR creates a robust, a...
